Edge Computing & AI Archives - Gopalam Embedded Systems

Technical Info
Description	3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake UP3) Processors
CPU	Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, 28W TDP (12W cTDP)
Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, 28W TDP (12W cTDP)
Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, 28W TDP (12W cTDP)
Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP
Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Max Cores	4
Memory	2x DDR4-3200 SODIMM slots
Up to 64GB with IBECC supported only with Intel® Core™ Industrial SoCs
Graphics	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60
HDR resolution or one display at 8K resolution
Video Interfaces	2x Multimode DisplayPort 1.4, on Dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
Video Resolution	DP, eDP Up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC
HDMI 1.4 Up to 4Kx2K 24-30Hz 24bpp
Mass Storage	M.2 SATA SSD slot (socket 2 Key B type 2242/3042) **
M.2 NVMe slot (socket 3 Key M type 2280) PCIe Gen4 supported
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
Networking	2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225
2.5GbE controllers
M.2 WWAN slot (socket 2 Key B type 2242/3042) coupled to on-board Micro-SIM slot. **
M.2 WiFi/BT slot (socket 1 Key E type 2230)
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
USB	2x SuperSpeed USB 10Gbps ports on Dual type-A socket
2x SuperSpeed USB 20Gbps ports on USB type-C slots
2x USB 2.0 on pin header
Audio	HD audio codec / Cirrus Logic CS4207
Mic In, Line Out and S/PDIF Out, on pin header
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on pin header
Other Interfaces	2x Expansion M.2 slot (socket 3 Key M type 2280) with 4x PCIe Gen3 lanes
8x GPIOs, 2x I2C, SPI connectors
FAN connector
RST_BTN#, PWR_BTN# and activity LED signals on pin header
Optional TPM 2.0 on-board
Power Supply	+12VDC .. +24VDC range
Cabled coin cell battery for RTC
Operating System	Microsoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)
Operating Temperature	0°C ÷ +60°C (Commercial version)
-40°C÷ +85°C (Industrial version)
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146 x 102 mm (3.5” form factor)

Technical Info
Description	Full connectivity on powerful AMD Ryzen™ platform
CPU	AMD Ryzen™ Embedded V1000 family SoCs:
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25
AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1000 family SoCs:
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W
Max Cores	4
Memory	2x DDR4 ECC and non-ECC SODIMM Slots
Support DDR4-2400 memories (DDR4-3200 with V1807B and V1756B), up to 32GB total
Graphics	GPU AMD Radeon™ VEGA with up to 11 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
4 independent displays supported (3 with R1000 SoCs)
Video Interfaces	4x DP++ connectors (only 3 working with R1000 SoCs)
Video Resolution	DP++: Up to 4096 x 2160
Mass Storage	M.2 NVMe slot (Socket 2 Key M Type 2280), PCI-e x4 interface
microSD Card slot (combo with miniSIM slot)
2x SATA 7p M connectors w/ 1x power connector
Networking	Up to 2 x Gigabit Ethernet ports
M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems
M.2 Connectivity Slot (Socket 1 Key E Type 2230)
USB	2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 3.0 (V1000 SoCs) / USB 2.0 (R1000 SoCs) Host port on WWAN M.2 slot
1 x USB 2.0 Host port on M.2 Connectivity Slot
PCI	1 x PCI-e x4 port on M.2 NVMe Slot
1 x PCI-e x1 port on M.2 WWAN Slot
1 x PCI-e x1 port on M.2 Connectivity Slot
2x PCI-e x1 on Gigabit Ethernet Controllers
Audio	HD Audio codec
Line Out + Microphone + S/PDIF Out interfaces on internal pin header
Serial Ports	2 x RS-232/RS-422/RS-485 UARTS, on internal Pin Header
Other Interfaces	miniSIM slot for M.2 modems (combo with microSD slot)
8 x GPI/Os connector
FAN connector
Switch / LED Front Header connector
2x I2C on internal pin header
Antitamper connector
Optional TPM 1.2 or 2.0 onboard
Power Supply	+12VDC÷ +24VDC
RTC battery
Operating System	Microsoft® Windows 10 (64-bit)
Linux
Operating Temperature	0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version, only for future SoCs in extended temperature range and with TDP ≤25W))
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm

Technical Info
Description	3.5" SBC with the NXP i.MX 8M Mini Processors
CPU	NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite – 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite – 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU
Max Cores	4+1
Memory	Soldered-down LPDDR4 memory, up to 4GB total, 32-bit interface
Graphics	GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support
Video Interfaces	LVDS Single/Dual Channel connector or eDP connector (factory alternatives)
MIPI-CSI Camera interface connector
Video Resolution	Up to 1920x1080p60, 24bpp
Mass Storage	Optional eMMC 5.1 drive on-board, up to 64GB
MicroSD slot
2Kb I2C Flash
QSPI Flash
Networking	2x GbEthernet interfaces (1 optional)
Optional shielded ultra-small dual Band WiFi 802.11 a/b/g/n/ac with Bluetooth 5.0 module onboard
Optional soldered on-board LTE Cat 4 Modem with SIM slot or Telenor eSIM with 5MB Bundle
USB	2x USB 2.0 Host ports on Type-A socket
2x USB 2.0 Host ports on internal pin header
1x USB Host or client port on micro-AB connector (interface shared with the optional on-board modem)
Audio	Digital Mic In connector (2x PDM inputs)
Amplified mono Speaker Output
Serial Ports	Up to 2x RS-232 or RS-485 or CAN Serial ports (factory options, shared with GPIOs and SPI interfaces)
2x Debug UARTS
Other Interfaces	I/O Connectors with: 2xPWM @3.3V GP I2C interface @3.3V 1x Open Drain output (max 12V, 250mA) 2x GPIOs @3.3V 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN (factory options) 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN + on-board ultra-low power RTC (factory options)
Watchdog
Dedicated connector for I2C Touch Screen Controller Support
Onboard Buzzer (Comm. temp. range only)
Optional Ultra Low Power RTC
Power Supply	+12VDC÷ +24VDC
Operating System	Yocto
Android (planned)
Operating Temperature	0°C ÷ +60°C (extended version)
-40°C ÷ +85°C (industrial version, limited to -30°C ÷ +85°C with WiFi/BT module on-board)
*Measured at any point of SECO standard heatsink for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm (3.5" form factor)

Technical Info
Description	3.5” SBC with Rockchip RK3568 SoC
CPU	Rockchip RK3568 processor 4x Cortex®-A55 cores, up to 2.0GHz, 64-bit architecture, with Neural Processing Unit (NPU)
Memory	Soldered-down DDR4-3200 memory, up to 4GB
Graphics	Mali-G52 1-Core-2EE GPU OpenGL ES 1.1/2.0/3.2 Vulkan 1.0 and 1.1 OpenCL 2.0 Full Profile
Embedded Video CODEC H.265/H.264/VP9 4K@60fps HW decoding VP8/VC1/MPEG-4/MPEG-2/MPEG-1 1080p @60fps HW decoding H.265/H.264 1080p@60fps HW encoding Supports 3 independent video outputs
Video Interfaces	HDMI
LVDS single / dual channel interface
eDP 1.3 interface
Video Resolution	HDMI: up to 4K x 2K @60Hz
LVDS: up to 1920 x 1080 @60Hz
eDP: up to 4096 x 2160 (4K)
Mass Storage	eMMC 5.1 drive soldered on-board, up to 64GB (first boot device)
microSD slot (second boot device)
I2C flash
QSPI flash (factory option)
Networking	2x Gigabit Ethernet ports, implemented using TI DP83867 Ethernet PHY on RGMII interface coming from SoC
Optional on-boad M.2 1216 module WLAN 802.11 a/b/g/n/ac + BT 5.0
M.2 Socket 2 Key B for LTE module + microSIM card slot on-board
USB	2x USB 3.0 Type-A
1x USB 2.0 Type-A
1x USB 2.0 OTG micro-AB muxed with one USB 3.0 (used for Deep Recovery)
1x USB 2.0 internal pin header
1x USB 2.0 internal pin header, dedicated to touch screen
Audio	TRRS combo audio jack (stereo mic in, stereo line out)
Mono speaker out (amplified 1.3Watt @8Ohm) on internal header
1x PDM signal ports on internal header
Serial Ports	1x debug UART
1x JTAG port
2x 4 wire RS-232 / RS-422 / RS-485 (multistandard transceivers) on internal header
2x 2 wire TTL UART ports on internal header
Other Interfaces	2x 2-lanes MIPI-CSI camera connector or 1x 4-lanes
M.2 Socket 2 Key M for AI accelerator modules
Dedicated connector for I2C touch screen controller
8x GPIOs or 4x GPIOs + 4 ADC (factory configuration alternatives)
2x CAN, 1x I2C, 1x SPI
Power Supply	+12VDC .. +24VDC range
RTC battery
Operating System	Linux Yocto
Android
Operating Temperature	0°C to +60°C (Commercial version)*
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146 x 102 mm (3.5” form factor)

SECO-Fanless Embedded Computers

December 1, 2023

ARM or x86
Scalable and customizable
Connectivity
Integration services

Technical Info
Description	Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3)
CPU	Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP)
Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP)
Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP)
Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP
Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Max Cores	4
Memory	2x DDR4-3200 SODIMM slots
Up to 64GB with IBECC supported only with Core™ industrial SoCs
Graphics	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to four independent displays at up to 4K60
HDR resolution or one display at 8K resolution
Video Interfaces	2x Multimode DisplayPort 1.4, on dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
Video Resolution	DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp
Mass Storage	On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
Networking	Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included*
Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included*
*Certification upon request
USB	2x Superspeed USB 10Gbps ports on Dual Type-A sockets
2x Superspeed USB 20Gbps on USB Type-C slots
Audio	Lineout + MicIn combo TRRS Audio Jack
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 8x GPIOs 1x I2C 1x SPI 1x 5V 1x 3.3V 1x 12V 3x GND
Power ON Button Optional TPM 1.2/2.0 module on-board
Power Supply	12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board
Operating System	Microsoft® Windows 10 IoT Enterprise LTSC
Linux LTS
Yocto
Operating Temperature	Commercial range: 0°C to +40°C, with 0.7m/s airflow**
Extended range: -30°C to +40°C, with 0.7m/s airflow**
**Up to 60°C with scaled down CPU TDP
Dimensions	199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)

Technical Info
Description	Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs
CPU	Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDP
Intel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDP
Intel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDP
Intel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDP
Intel® Atom® x6211E Dual Core @1.3GHz (3GHz Turbo) 6W TDP w/ IBECC and HIS - Industrial
Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP w/ IBECC and HIS - Industrial
Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP w/ IBECC and IHS - Industrial
Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/ IBECC, IHS and TCC – Industrial
Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/ IBECC, IHS and TCC – Industrial
Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC – Industrial
(*) HIS: Integrated Heatspreader; TCC: Time Coordinated Computing
Memory	Soldered down LPDDR4-3200 memory, up to 16GB with IBECC supported only with Atom® Industrial SoCs
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual rank (16GB)
Graphics	Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8, VP9, WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0
Video Interfaces	2x Multimode DisplayPort 1.4, on Dual DP++ connector
Video Resolution	Up to 4096x2160 @60Hz
Mass Storage	Optional eMMC 5.1 drive soldered on-board
Optional on-board M.2 SATA SSD **
** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.
Networking	2x Gigabit Ethernet RJ45 connectors
Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) +BT 5.0 module, external antennas*
Optional on-board M.2 LTE modem with nanoSIM slot, external antennas* **
*Certification upon request
** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.
USB	Dual USB 3.2 Gen1 Type-A connector
Audio	Lineout + MicIn combo TRRS audio jack
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 2x CAN 8x GPIOs / QEP / PWM / SPI 2x I2C 1x SPI 1x 5V 1x 3.3V 1x 12V 3x GND
Power ON button
nanoSIM slot soldered on-board for the modem
Optional TPM 1.2/2.0 module on-board
Optional 4x SMA connectors for external Wi-Fi / WWAN antennas
Power Supply	+12VDC
Cabled coin cell battery for RTC
Operating System	Microsoft® Windows 10 Enterprise
Microsoft® Windows 10 IoT Core
Linux
Yocto
Dimensions	180 x 107 x 75 mm (7” x 4.2” x 3’’)

Technical Info
Description	Fanless Embedded Computer based on Rockchip RK3399 Applications Processor
CPU	Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x Cortex®-A53 MP cores, up to 1.8GHz, 64-bit architecture
Memory	64-bit soldered down LPDDR4 memory, up to 4GB
Graphics	4-Core Mali-T860MP4 GPU
OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support
Embedded VPU, able to offer: H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding H.264, VP8 1080p@30fps HW encoding
Video Interfaces	HDMI™ connector
DP interface on USB Type-C connector (Alternate mode)
Video Resolution	Up to 4K
Mass Storage	Optional eMMC 5.1 drive on-board, up to 64GB
Networking	2x Gigabit Ethernet RJ45 connectors
Optional on-board WiFi (802.11 ac / a / b / g / n) +BT 5.0 module, external antennas*
Optional on-board LTE modem with miniSIM slot or eSIM, external antennas*
*Certification upon request
USB	2 x USB 2.0 on Dual Type-A socket
1 x USB 3.0 Type-C connector (alternate mode with DP)
1 x USB 3.0 Type-A connector
Audio	Lineout + MicIn combo TRRS Audio Jack
Serial Ports	2 x RS-232 or RS-485 ports (factory options) on DB9-M connectors
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 2x CAN 3x GPIOs 1x Open Drain Output 1x PWM 1x I2C 1x 5V 1x 3.3V 1x 12V 3x GND
Power ON Button with integrated LED
miniSIM slot soldered on-board for the Modem
Optional 4x SMA connectors for external WiFi / WWAN antennas
Power Supply	+12VDC ÷ +24VDC, DC Power Jack
Operating System	Linux Yocto
Android (planned)
Operating Temperature	0°C ÷ +50°C
Dimensions	181 x 107 x 75 mm

Technical Info
Description	Clea is a combination between the Easy Edge microcontroller and the AI Suite solution. Clea merges the hardware with the AI Suite services creating a subscription service for industrial enterprises of any size. Upon subscribing to Clea, SECO retrofits the customer’s machines with Easy Edge Microcontroller. Clea enhances products with Artificial intelligence, minimizing downtime and boosting productivity. Easy Edge is a Low Power, Feature-rich high Performance Microcontroller with Embedded Connectivity. Easy Edge is a mobile connected (LTE-M/NB-IoT or 2G + Wi-Fi, BT) microcontroller. More on Clea: https://www.seco.com/en/services/Clea_IoT_Platform_AI_Inside
CPU	ESP32-D0WD-V3 Dual Core Xtensa® 32-bit LX6 Microprocessor
Max Cores	2
Memory	Internal 520KB SRAM + 16KB SRAM in RTC
Mass Storage	16MB SPI Flash
8MB PSRAM
microSD slot
Networking	Embedded WiFi (802.11 b/g/n) + BT 4.2/BT LE module
Optional Modem with GNSS functionality: Quad Band GSM/GPRS Modem, SIMCOM SIM868 Global-Band LTE CAT-M / NB-IoT modem, SIMCOM SIM7080G
Serial Ports	RS-232 / TTL UART (jumper selectable) port on 6-pin dedicated connector
Other Interfaces	Accelerometer
Optional Trusted Secure Element
Expansion 8-pin connector, able to manage: Up to 3x Digital GPIOS, 2 of them managed also in UltraLow Power States too Up to 2x analog Inputs I2C interface (fixed interface) Additional 2-Wire UART Second I2C interface Up to 2x PWM
1x Pushbutton
White LED for Power On Signaling
Green LED fro Modem Activity Signaling
Blue LED for Edgehog network connection signaling
Yellow LED for WiFi/BT activity or other signaling
eSIM or microSIM slot (factory options)
SMA connectors for WiFi/BT, Modem and GNNS (antennas not provided)
Power Supply	2-pin micro-Fit Connector
+9VDC .. +24VDC
Optional 2000mAh rechargeable battery, LIR18650
Operating Temperature	0°÷+45°C
Dimensions	110 x 91 x31 mm (LxWxD)

Technical Info
Description	Panel PC with 21.5” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors
CPU	Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
Max Cores	4
Memory	Dual/ Quad Channel soldered down LPDDR4 memory, up to 8GB
Graphics	Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
Video Interfaces	Two DP++ 1.2 interfaces on miniDP connectors
Video Resolution	1920x1080
Mass Storage	M.2 2260 SATA SSD Module, up to 512GB
Networking	Dual Gigabit Ethernet RJ45 connector with Gigabit Ethernet i210 controllers
M.2 WLAN Connectivity Slot for accessory WiFi/BT module
USB	2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
Other Interfaces	Power ON Button with integrated LED
TPM 2.0 on-board
2x SMA connectors for external WiFi antennas
Power Supply	+18VDC ÷ +32 VDC recommended
+15VDC ÷ +36 VDC absolute
RTC battery
Operating System	Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Yocto (64 bit)
Linux
Operating Temperature	0°C ÷ +50°C *
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	537 x 328,5 x 53,5 mm

Technical Info
Description	Panel PC with 13.3” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors
CPU	Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
Intel® Celeron® J3455 Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
Intel® Celeron® J3355 Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TD
Memory	Soldered-down LPDDR4 memory Dual/Quad Channel, up to 8GB total, 32-bit interface
Graphics	Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG formats
Video Interfaces	HDMI Connector
DP++ Connector
Video Resolution	13.3” LVDS display, resolution 1920x1080, LED lifetime 50K hours life typ-, 260cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H
Mass Storage	eMMC 5.0 drive soldered on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB
Networking	2x Gigabit Ethernet port
M.2 WWAN Connectivity Slot for accessory 4G modules (excludes SSD Drive)
M.2 WLAN Connectivity Slot for accessory WiFi/BT module
USB	2x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Dual Type-A socket
Serial Ports	2x multistandard RS-232 /RS-422/RS-485 ports on DB-9 connectors
Other Interfaces	Power ON Button with integrated LED
Optional TPM 2.0 onboard
Power Supply	Main Power: 12VDC
Power In connectors: DC Power Jack
Operating System	Windows 10 IOT
Linux
Operating Temperature	0°C ÷ 50°C*
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	349,2 x 220,8 x 58mm

Technical Info
Description	Panel PC with 13.3” LCD display based on Rockchip RK3399 SoC
CPU	CPU Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MPCores, up to 1.8GHz, 64-bit
Max Cores	4
Memory	Memory Soldered-down LPDDR4 memory, up to 4GB total, 64-bit
Graphics	4-Core Mali-T860MP4 GPU, supporting OpenGL ES
1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL
Embedded VPU, able to offer: H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW
Decoding MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding H.264, VP8 1080p@30fps HW encoding
Dual Display support
Video Interfaces	HDMI 4K interface
DP 1.2 interface on USB Type-C connector (alternate mode)
Video Resolution	13.3” LVDS display, resolution 1920x1080, LED lifetime 50K
hours life min, 260cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass
cover
Glass Hardness IK07, Surface Hardness 7H
Mass Storage	Storage eMMC drive soldered on-board, up to 64GB
Optional SPI
Networking	2x Gigabit Ethernet port
Soldered on-board M.2 1216 WLAN 802.11 a/b/g/n/ac + BT
5.0 module*
On-board LTE Modem*
*Certification upon request
USB	1x USB 3.0 Type-C port (Alternate mode with DP)
1x USB 3.0 Host port on Type-A socket
2 x USB 2.0 Host ports on Dual Type-A socket
Audio	TRRS Audio Jack (Combo MicIn + Lineout)
Serial Ports	2x RS-232 or RS-485 (factory option) on DB-9 connectors
Other Interfaces	Power ON Button with integrated LED
Ultra Low Power SPI RTC
Power Supply	Main Power: 12VDC .. 24VDC
Power In connectors: DC Power Jack.
Operating System	Linux
Operating Temperature	0°C ÷ 50°C
Dimensions	349,2 x 220,8 x 58 mm

Technical Info
Description	This Human Machine Interface is based on our SBC-SANTARO-MX6. It is characterized by the high brightness of the TFT display in combination with optical bonding of the capacitive touch screen and offers the user an optimized interaction even in strong sunlight. The fully integrated fanless industrial PC is designed for easy installation. It's designed to be mounted from the rear to your front and offers protection against environmental influences thanks to the existing seal. The particularly robust glass provides protection against vandalism.
CPU	NXP i.MX 6 Family based on ARM® Cortex®-A9 cores : i.MX 6 Quad – Full featured, 4x Cortex®-A9 cores up to 1.0GHz i.MX 6 Dual – Full featured, 4x Cortex®-A9 cores up to 1.0GHz i.MX 6 Single – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
Memory	1 GB 64 bit DDR3L
Graphics	Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D OpenVG™ accelerator
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
Video Interfaces	HDMI interface
Video Resolution	7.0 inch display, resolution 800 x 480, LED lifetime typ. 70k hours
typ. 1000 cd/m² brightness
P-Cap (Projected Capacitive touch screen) - optical bonded, with 5.0mm toughened glass cover, Pantone
black C
Mass Storage	eMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC
Networking	1x 100MbEthernet
USB	1x USB 2.0 OTG micro-AB
1x USB 2.0 Type-A
Audio	1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker
Serial Ports	2x RS-232, RS-485
Other Interfaces	2x Digital Input, 2x Digital Output
Power Supply	9 ÷ 32 VDC
Operating System	Yocto
Operating Temperature	0°C ÷ +60°C
Dimensions	220.5 x 150.9 x 43.4 mm

Technical Info
Description	The seven-inch Panel Mount HMI with its robust design can be easily integrated into a product. Equipped with the latest SBC model from by Garz & Fricke, it features the modern i.MX 8M Mini processor generation from NXP. Manufactured in the modern 14 nm FinFET process, this processor offers high performance with low power consumption and low operating temperature - even at extremely high performance requirements. The display features high resolution with 1024x600 pixel and a capacitive touchscreen for advanced user interaction. Multiple connectivity options such as RS232, RS485, CAN multiple USBs as well as 1GB Ethernet and integrated Wifi/BT make the Tanaro Vision 7 PM MX8M-Mini a future-proof HMI solution and perfect operating unit. The integrated MIPI-CSI camera interface also offers the option to integrate camera solutions. This also allows applications such as image processing and evaluation to be implemented without any problems.
CPU	NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual Lite – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo Lite – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
Memory	1 GB 32 bit LPDDR4
Graphics	GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer: VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding AVC/H.264, VP8 HW encoding OpenGL ES 2.0, OpenVG 1.1 support
Video Interfaces	MIPI-CSI Camera interface connector
Video Resolution	7.0 inch LVDS display, resolution 1024x600, LED lifetime typ. 20k hours
typ. 420 cd/m² brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm toughened glass cover, RAL 9005
Mass Storage	eMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC
Networking	1x GbEthernet interfaces
1x 100MbEthernet
shielded single band WiFi 802.11 b/g/n with Bluetooth 4.0
mPCIe (half size) socket for modems
USB	1x USB 2.0 OTG micro-AB
up to 2x USB 2.0 Type-A
Audio	1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker
Digital Mic In connector (2x PDM inputs)
Serial Ports	2x RS-232, RS-485
Power Supply	9 ÷ 32 VDC
Operating System	Linux Yocto
Operating Temperature	0°C ÷ +60°C
Dimensions	202.0 x 126.2 x 35.5 mm

Technical Info
Description	3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake UP3) Processors
CPU	Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, 28W TDP (12W cTDP)
Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, 28W TDP (12W cTDP)
Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, 28W TDP (12W cTDP)
Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP
Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Max Cores	4
Memory	2x DDR4-3200 SODIMM slots
Up to 64GB with IBECC supported only with Intel® Core™ Industrial SoCs
Graphics	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60
HDR resolution or one display at 8K resolution
Video Interfaces	2x Multimode DisplayPort 1.4, on Dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
Video Resolution	DP, eDP Up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC
HDMI 1.4 Up to 4Kx2K 24-30Hz 24bpp
Mass Storage	M.2 SATA SSD slot (socket 2 Key B type 2242/3042) **
M.2 NVMe slot (socket 3 Key M type 2280) PCIe Gen4 supported
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
Networking	2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225
2.5GbE controllers
M.2 WWAN slot (socket 2 Key B type 2242/3042) coupled to on-board Micro-SIM slot. **
M.2 WiFi/BT slot (socket 1 Key E type 2230)
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
USB	2x SuperSpeed USB 10Gbps ports on Dual type-A socket
2x SuperSpeed USB 20Gbps ports on USB type-C slots
2x USB 2.0 on pin header
Audio	HD audio codec / Cirrus Logic CS4207
Mic In, Line Out and S/PDIF Out, on pin header
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on pin header
Other Interfaces	2x Expansion M.2 slot (socket 3 Key M type 2280) with 4x PCIe Gen3 lanes
8x GPIOs, 2x I2C, SPI connectors
FAN connector
RST_BTN#, PWR_BTN# and activity LED signals on pin header
Optional TPM 2.0 on-board
Power Supply	+12VDC .. +24VDC range
Cabled coin cell battery for RTC
Operating System	Microsoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)
Operating Temperature	0°C ÷ +60°C (Commercial version)
-40°C÷ +85°C (Industrial version)
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146 x 102 mm (3.5” form factor)

Technical Info
Description	Full connectivity on powerful AMD Ryzen™ platform
CPU	AMD Ryzen™ Embedded V1000 family SoCs:
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25
AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1000 family SoCs:
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W
Max Cores	4
Memory	2x DDR4 ECC and non-ECC SODIMM Slots
Support DDR4-2400 memories (DDR4-3200 with V1807B and V1756B), up to 32GB total
Graphics	GPU AMD Radeon™ VEGA with up to 11 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
4 independent displays supported (3 with R1000 SoCs)
Video Interfaces	4x DP++ connectors (only 3 working with R1000 SoCs)
Video Resolution	DP++: Up to 4096 x 2160
Mass Storage	M.2 NVMe slot (Socket 2 Key M Type 2280), PCI-e x4 interface
microSD Card slot (combo with miniSIM slot)
2x SATA 7p M connectors w/ 1x power connector
Networking	Up to 2 x Gigabit Ethernet ports
M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems
M.2 Connectivity Slot (Socket 1 Key E Type 2230)
USB	2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 3.0 (V1000 SoCs) / USB 2.0 (R1000 SoCs) Host port on WWAN M.2 slot
1 x USB 2.0 Host port on M.2 Connectivity Slot
PCI	1 x PCI-e x4 port on M.2 NVMe Slot
1 x PCI-e x1 port on M.2 WWAN Slot
1 x PCI-e x1 port on M.2 Connectivity Slot
2x PCI-e x1 on Gigabit Ethernet Controllers
Audio	HD Audio codec
Line Out + Microphone + S/PDIF Out interfaces on internal pin header
Serial Ports	2 x RS-232/RS-422/RS-485 UARTS, on internal Pin Header
Other Interfaces	miniSIM slot for M.2 modems (combo with microSD slot)
8 x GPI/Os connector
FAN connector
Switch / LED Front Header connector
2x I2C on internal pin header
Antitamper connector
Optional TPM 1.2 or 2.0 onboard
Power Supply	+12VDC÷ +24VDC
RTC battery
Operating System	Microsoft® Windows 10 (64-bit)
Linux
Operating Temperature	0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version, only for future SoCs in extended temperature range and with TDP ≤25W))
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm

Technical Info
Description	3.5" SBC with the NXP i.MX 8M Mini Processors
CPU	NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite – 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite – 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU
Max Cores	4+1
Memory	Soldered-down LPDDR4 memory, up to 4GB total, 32-bit interface
Graphics	GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support
Video Interfaces	LVDS Single/Dual Channel connector or eDP connector (factory alternatives)
MIPI-CSI Camera interface connector
Video Resolution	Up to 1920x1080p60, 24bpp
Mass Storage	Optional eMMC 5.1 drive on-board, up to 64GB
MicroSD slot
2Kb I2C Flash
QSPI Flash
Networking	2x GbEthernet interfaces (1 optional)
Optional shielded ultra-small dual Band WiFi 802.11 a/b/g/n/ac with Bluetooth 5.0 module onboard
Optional soldered on-board LTE Cat 4 Modem with SIM slot or Telenor eSIM with 5MB Bundle
USB	2x USB 2.0 Host ports on Type-A socket
2x USB 2.0 Host ports on internal pin header
1x USB Host or client port on micro-AB connector (interface shared with the optional on-board modem)
Audio	Digital Mic In connector (2x PDM inputs)
Amplified mono Speaker Output
Serial Ports	Up to 2x RS-232 or RS-485 or CAN Serial ports (factory options, shared with GPIOs and SPI interfaces)
2x Debug UARTS
Other Interfaces	I/O Connectors with: 2xPWM @3.3V GP I2C interface @3.3V 1x Open Drain output (max 12V, 250mA) 2x GPIOs @3.3V 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN (factory options) 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN + on-board ultra-low power RTC (factory options)
Watchdog
Dedicated connector for I2C Touch Screen Controller Support
Onboard Buzzer (Comm. temp. range only)
Optional Ultra Low Power RTC
Power Supply	+12VDC÷ +24VDC
Operating System	Yocto
Android (planned)
Operating Temperature	0°C ÷ +60°C (extended version)
-40°C ÷ +85°C (industrial version, limited to -30°C ÷ +85°C with WiFi/BT module on-board)
*Measured at any point of SECO standard heatsink for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm (3.5" form factor)

Technical Info
Description	3.5” SBC with Rockchip RK3568 SoC
CPU	Rockchip RK3568 processor 4x Cortex®-A55 cores, up to 2.0GHz, 64-bit architecture, with Neural Processing Unit (NPU)
Memory	Soldered-down DDR4-3200 memory, up to 4GB
Graphics	Mali-G52 1-Core-2EE GPU OpenGL ES 1.1/2.0/3.2 Vulkan 1.0 and 1.1 OpenCL 2.0 Full Profile
Embedded Video CODEC H.265/H.264/VP9 4K@60fps HW decoding VP8/VC1/MPEG-4/MPEG-2/MPEG-1 1080p @60fps HW decoding H.265/H.264 1080p@60fps HW encoding Supports 3 independent video outputs
Video Interfaces	HDMI
LVDS single / dual channel interface
eDP 1.3 interface
Video Resolution	HDMI: up to 4K x 2K @60Hz
LVDS: up to 1920 x 1080 @60Hz
eDP: up to 4096 x 2160 (4K)
Mass Storage	eMMC 5.1 drive soldered on-board, up to 64GB (first boot device)
microSD slot (second boot device)
I2C flash
QSPI flash (factory option)
Networking	2x Gigabit Ethernet ports, implemented using TI DP83867 Ethernet PHY on RGMII interface coming from SoC
Optional on-boad M.2 1216 module WLAN 802.11 a/b/g/n/ac + BT 5.0
M.2 Socket 2 Key B for LTE module + microSIM card slot on-board
USB	2x USB 3.0 Type-A
1x USB 2.0 Type-A
1x USB 2.0 OTG micro-AB muxed with one USB 3.0 (used for Deep Recovery)
1x USB 2.0 internal pin header
1x USB 2.0 internal pin header, dedicated to touch screen
Audio	TRRS combo audio jack (stereo mic in, stereo line out)
Mono speaker out (amplified 1.3Watt @8Ohm) on internal header
1x PDM signal ports on internal header
Serial Ports	1x debug UART
1x JTAG port
2x 4 wire RS-232 / RS-422 / RS-485 (multistandard transceivers) on internal header
2x 2 wire TTL UART ports on internal header
Other Interfaces	2x 2-lanes MIPI-CSI camera connector or 1x 4-lanes
M.2 Socket 2 Key M for AI accelerator modules
Dedicated connector for I2C touch screen controller
8x GPIOs or 4x GPIOs + 4 ADC (factory configuration alternatives)
2x CAN, 1x I2C, 1x SPI
Power Supply	+12VDC .. +24VDC range
RTC battery
Operating System	Linux Yocto
Android
Operating Temperature	0°C to +60°C (Commercial version)*
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146 x 102 mm (3.5” form factor)

Technical Info
Description	Panel PC with 21.5” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors
CPU	Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
Max Cores	4
Memory	Dual/ Quad Channel soldered down LPDDR4 memory, up to 8GB
Graphics	Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
Video Interfaces	Two DP++ 1.2 interfaces on miniDP connectors
Video Resolution	1920x1080
Mass Storage	M.2 2260 SATA SSD Module, up to 512GB
Networking	Dual Gigabit Ethernet RJ45 connector with Gigabit Ethernet i210 controllers
M.2 WLAN Connectivity Slot for accessory WiFi/BT module
USB	2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
Other Interfaces	Power ON Button with integrated LED
TPM 2.0 on-board
2x SMA connectors for external WiFi antennas
Power Supply	+18VDC ÷ +32 VDC recommended
+15VDC ÷ +36 VDC absolute
RTC battery
Operating System	Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Yocto (64 bit)
Linux
Operating Temperature	0°C ÷ +50°C *
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	537 x 328,5 x 53,5 mm

Technical Info
Description	Panel PC with 13.3” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors
CPU	Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
Intel® Celeron® J3455 Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
Intel® Celeron® J3355 Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TD
Memory	Soldered-down LPDDR4 memory Dual/Quad Channel, up to 8GB total, 32-bit interface
Graphics	Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG formats
Video Interfaces	HDMI Connector
DP++ Connector
Video Resolution	13.3” LVDS display, resolution 1920x1080, LED lifetime 50K hours life typ-, 260cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H
Mass Storage	eMMC 5.0 drive soldered on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB
Networking	2x Gigabit Ethernet port
M.2 WWAN Connectivity Slot for accessory 4G modules (excludes SSD Drive)
M.2 WLAN Connectivity Slot for accessory WiFi/BT module
USB	2x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Dual Type-A socket
Serial Ports	2x multistandard RS-232 /RS-422/RS-485 ports on DB-9 connectors
Other Interfaces	Power ON Button with integrated LED
Optional TPM 2.0 onboard
Power Supply	Main Power: 12VDC
Power In connectors: DC Power Jack
Operating System	Windows 10 IOT
Linux
Operating Temperature	0°C ÷ 50°C*
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	349,2 x 220,8 x 58mm

Technical Info
Description	Panel PC with 13.3” LCD display based on Rockchip RK3399 SoC
CPU	CPU Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MPCores, up to 1.8GHz, 64-bit
Max Cores	4
Memory	Memory Soldered-down LPDDR4 memory, up to 4GB total, 64-bit
Graphics	4-Core Mali-T860MP4 GPU, supporting OpenGL ES
1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL
Embedded VPU, able to offer: H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW
Decoding MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding H.264, VP8 1080p@30fps HW encoding
Dual Display support
Video Interfaces	HDMI 4K interface
DP 1.2 interface on USB Type-C connector (alternate mode)
Video Resolution	13.3” LVDS display, resolution 1920x1080, LED lifetime 50K
hours life min, 260cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass
cover
Glass Hardness IK07, Surface Hardness 7H
Mass Storage	Storage eMMC drive soldered on-board, up to 64GB
Optional SPI
Networking	2x Gigabit Ethernet port
Soldered on-board M.2 1216 WLAN 802.11 a/b/g/n/ac + BT
5.0 module*
On-board LTE Modem*
*Certification upon request
USB	1x USB 3.0 Type-C port (Alternate mode with DP)
1x USB 3.0 Host port on Type-A socket
2 x USB 2.0 Host ports on Dual Type-A socket
Audio	TRRS Audio Jack (Combo MicIn + Lineout)
Serial Ports	2x RS-232 or RS-485 (factory option) on DB-9 connectors
Other Interfaces	Power ON Button with integrated LED
Ultra Low Power SPI RTC
Power Supply	Main Power: 12VDC .. 24VDC
Power In connectors: DC Power Jack.
Operating System	Linux
Operating Temperature	0°C ÷ 50°C
Dimensions	349,2 x 220,8 x 58 mm

Technical Info
Description	This Human Machine Interface is based on our SBC-SANTARO-MX6. It is characterized by the high brightness of the TFT display in combination with optical bonding of the capacitive touch screen and offers the user an optimized interaction even in strong sunlight. The fully integrated fanless industrial PC is designed for easy installation. It's designed to be mounted from the rear to your front and offers protection against environmental influences thanks to the existing seal. The particularly robust glass provides protection against vandalism.
CPU	NXP i.MX 6 Family based on ARM® Cortex®-A9 cores : i.MX 6 Quad – Full featured, 4x Cortex®-A9 cores up to 1.0GHz i.MX 6 Dual – Full featured, 4x Cortex®-A9 cores up to 1.0GHz i.MX 6 Single – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
Memory	1 GB 64 bit DDR3L
Graphics	Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D OpenVG™ accelerator
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
Video Interfaces	HDMI interface
Video Resolution	7.0 inch display, resolution 800 x 480, LED lifetime typ. 70k hours
typ. 1000 cd/m² brightness
P-Cap (Projected Capacitive touch screen) - optical bonded, with 5.0mm toughened glass cover, Pantone
black C
Mass Storage	eMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC
Networking	1x 100MbEthernet
USB	1x USB 2.0 OTG micro-AB
1x USB 2.0 Type-A
Audio	1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker
Serial Ports	2x RS-232, RS-485
Other Interfaces	2x Digital Input, 2x Digital Output
Power Supply	9 ÷ 32 VDC
Operating System	Yocto
Operating Temperature	0°C ÷ +60°C
Dimensions	220.5 x 150.9 x 43.4 mm

Technical Info
Description	The seven-inch Panel Mount HMI with its robust design can be easily integrated into a product. Equipped with the latest SBC model from by Garz & Fricke, it features the modern i.MX 8M Mini processor generation from NXP. Manufactured in the modern 14 nm FinFET process, this processor offers high performance with low power consumption and low operating temperature - even at extremely high performance requirements. The display features high resolution with 1024x600 pixel and a capacitive touchscreen for advanced user interaction. Multiple connectivity options such as RS232, RS485, CAN multiple USBs as well as 1GB Ethernet and integrated Wifi/BT make the Tanaro Vision 7 PM MX8M-Mini a future-proof HMI solution and perfect operating unit. The integrated MIPI-CSI camera interface also offers the option to integrate camera solutions. This also allows applications such as image processing and evaluation to be implemented without any problems.
CPU	NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual Lite – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo Lite – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
Memory	1 GB 32 bit LPDDR4
Graphics	GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer: VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding AVC/H.264, VP8 HW encoding OpenGL ES 2.0, OpenVG 1.1 support
Video Interfaces	MIPI-CSI Camera interface connector
Video Resolution	7.0 inch LVDS display, resolution 1024x600, LED lifetime typ. 20k hours
typ. 420 cd/m² brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm toughened glass cover, RAL 9005
Mass Storage	eMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC
Networking	1x GbEthernet interfaces
1x 100MbEthernet
shielded single band WiFi 802.11 b/g/n with Bluetooth 4.0
mPCIe (half size) socket for modems
USB	1x USB 2.0 OTG micro-AB
up to 2x USB 2.0 Type-A
Audio	1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker
Digital Mic In connector (2x PDM inputs)
Serial Ports	2x RS-232, RS-485
Power Supply	9 ÷ 32 VDC
Operating System	Linux Yocto
Operating Temperature	0°C ÷ +60°C
Dimensions	202.0 x 126.2 x 35.5 mm

SECO-Fanless Embedded Computers

November 28, 2023

ARM or x86
Scalable and customizable
Connectivity
Integration services

Technical Info
Description	Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3)
CPU	Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP)
Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP)
Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP)
Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP
Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Max Cores	4
Memory	2x DDR4-3200 SODIMM slots
Up to 64GB with IBECC supported only with Core™ industrial SoCs
Graphics	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to four independent displays at up to 4K60
HDR resolution or one display at 8K resolution
Video Interfaces	2x Multimode DisplayPort 1.4, on dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
Video Resolution	DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp
Mass Storage	On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
Networking	Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included*
Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included*
*Certification upon request
USB	2x Superspeed USB 10Gbps ports on Dual Type-A sockets
2x Superspeed USB 20Gbps on USB Type-C slots
Audio	Lineout + MicIn combo TRRS Audio Jack
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 8x GPIOs 1x I2C 1x SPI 1x 5V 1x 3.3V 1x 12V 3x GND
Power ON Button Optional TPM 1.2/2.0 module on-board
Power Supply	12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board
Operating System	Microsoft® Windows 10 IoT Enterprise LTSC
Linux LTS
Yocto
Operating Temperature	Commercial range: 0°C to +40°C, with 0.7m/s airflow**
Extended range: -30°C to +40°C, with 0.7m/s airflow**
**Up to 60°C with scaled down CPU TDP
Dimensions	199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)

Technical Info
Description	Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs
CPU	Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDP
Intel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDP
Intel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDP
Intel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDP
Intel® Atom® x6211E Dual Core @1.3GHz (3GHz Turbo) 6W TDP w/ IBECC and HIS - Industrial
Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP w/ IBECC and HIS - Industrial
Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP w/ IBECC and IHS - Industrial
Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/ IBECC, IHS and TCC – Industrial
Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/ IBECC, IHS and TCC – Industrial
Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC – Industrial
(*) HIS: Integrated Heatspreader; TCC: Time Coordinated Computing
Memory	Soldered down LPDDR4-3200 memory, up to 16GB with IBECC supported only with Atom® Industrial SoCs
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual rank (16GB)
Graphics	Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8, VP9, WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0
Video Interfaces	2x Multimode DisplayPort 1.4, on Dual DP++ connector
Video Resolution	Up to 4096x2160 @60Hz
Mass Storage	Optional eMMC 5.1 drive soldered on-board
Optional on-board M.2 SATA SSD **
** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.
Networking	2x Gigabit Ethernet RJ45 connectors
Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) +BT 5.0 module, external antennas*
Optional on-board M.2 LTE modem with nanoSIM slot, external antennas* **
*Certification upon request
** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.
USB	Dual USB 3.2 Gen1 Type-A connector
Audio	Lineout + MicIn combo TRRS audio jack
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 2x CAN 8x GPIOs / QEP / PWM / SPI 2x I2C 1x SPI 1x 5V 1x 3.3V 1x 12V 3x GND
Power ON button
nanoSIM slot soldered on-board for the modem
Optional TPM 1.2/2.0 module on-board
Optional 4x SMA connectors for external Wi-Fi / WWAN antennas
Power Supply	+12VDC
Cabled coin cell battery for RTC
Operating System	Microsoft® Windows 10 Enterprise
Microsoft® Windows 10 IoT Core
Linux
Yocto
Dimensions	180 x 107 x 75 mm (7” x 4.2” x 3’’)

Technical Info
Description	Fanless Embedded Computer based on Rockchip RK3399 Applications Processor
CPU	Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x Cortex®-A53 MP cores, up to 1.8GHz, 64-bit architecture
Memory	64-bit soldered down LPDDR4 memory, up to 4GB
Graphics	4-Core Mali-T860MP4 GPU
OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support
Embedded VPU, able to offer: H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding H.264, VP8 1080p@30fps HW encoding
Video Interfaces	HDMI™ connector
DP interface on USB Type-C connector (Alternate mode)
Video Resolution	Up to 4K
Mass Storage	Optional eMMC 5.1 drive on-board, up to 64GB
Networking	2x Gigabit Ethernet RJ45 connectors
Optional on-board WiFi (802.11 ac / a / b / g / n) +BT 5.0 module, external antennas*
Optional on-board LTE modem with miniSIM slot or eSIM, external antennas*
*Certification upon request
USB	2 x USB 2.0 on Dual Type-A socket
1 x USB 3.0 Type-C connector (alternate mode with DP)
1 x USB 3.0 Type-A connector
Audio	Lineout + MicIn combo TRRS Audio Jack
Serial Ports	2 x RS-232 or RS-485 ports (factory options) on DB9-M connectors
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 2x CAN 3x GPIOs 1x Open Drain Output 1x PWM 1x I2C 1x 5V 1x 3.3V 1x 12V 3x GND
Power ON Button with integrated LED
miniSIM slot soldered on-board for the Modem
Optional 4x SMA connectors for external WiFi / WWAN antennas
Power Supply	+12VDC ÷ +24VDC, DC Power Jack
Operating System	Linux Yocto
Android (planned)
Operating Temperature	0°C ÷ +50°C
Dimensions	181 x 107 x 75 mm

Technical Info
Description	Clea is a combination between the Easy Edge microcontroller and the AI Suite solution. Clea merges the hardware with the AI Suite services creating a subscription service for industrial enterprises of any size. Upon subscribing to Clea, SECO retrofits the customer’s machines with Easy Edge Microcontroller. Clea enhances products with Artificial intelligence, minimizing downtime and boosting productivity. Easy Edge is a Low Power, Feature-rich high Performance Microcontroller with Embedded Connectivity. Easy Edge is a mobile connected (LTE-M/NB-IoT or 2G + Wi-Fi, BT) microcontroller. More on Clea: https://www.seco.com/en/services/Clea_IoT_Platform_AI_Inside
CPU	ESP32-D0WD-V3 Dual Core Xtensa® 32-bit LX6 Microprocessor
Max Cores	2
Memory	Internal 520KB SRAM + 16KB SRAM in RTC
Mass Storage	16MB SPI Flash
8MB PSRAM
microSD slot
Networking	Embedded WiFi (802.11 b/g/n) + BT 4.2/BT LE module
Optional Modem with GNSS functionality: Quad Band GSM/GPRS Modem, SIMCOM SIM868 Global-Band LTE CAT-M / NB-IoT modem, SIMCOM SIM7080G
Serial Ports	RS-232 / TTL UART (jumper selectable) port on 6-pin dedicated connector
Other Interfaces	Accelerometer
Optional Trusted Secure Element
Expansion 8-pin connector, able to manage: Up to 3x Digital GPIOS, 2 of them managed also in UltraLow Power States too Up to 2x analog Inputs I2C interface (fixed interface) Additional 2-Wire UART Second I2C interface Up to 2x PWM
1x Pushbutton
White LED for Power On Signaling
Green LED fro Modem Activity Signaling
Blue LED for Edgehog network connection signaling
Yellow LED for WiFi/BT activity or other signaling
eSIM or microSIM slot (factory options)
SMA connectors for WiFi/BT, Modem and GNNS (antennas not provided)
Power Supply	2-pin micro-Fit Connector
+9VDC .. +24VDC
Optional 2000mAh rechargeable battery, LIR18650
Operating Temperature	0°÷+45°C
Dimensions	110 x 91 x31 mm (LxWxD)

Technical Info
Description	3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake UP3) Processors
CPU	Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, 28W TDP (12W cTDP)
Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, 28W TDP (12W cTDP)
Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, 28W TDP (12W cTDP)
Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP
Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Max Cores	4
Memory	2x DDR4-3200 SODIMM slots
Up to 64GB with IBECC supported only with Intel® Core™ Industrial SoCs
Graphics	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60
HDR resolution or one display at 8K resolution
Video Interfaces	2x Multimode DisplayPort 1.4, on Dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
Video Resolution	DP, eDP Up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC
HDMI 1.4 Up to 4Kx2K 24-30Hz 24bpp
Mass Storage	M.2 SATA SSD slot (socket 2 Key B type 2242/3042) **
M.2 NVMe slot (socket 3 Key M type 2280) PCIe Gen4 supported
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
Networking	2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225
2.5GbE controllers
M.2 WWAN slot (socket 2 Key B type 2242/3042) coupled to on-board Micro-SIM slot. **
M.2 WiFi/BT slot (socket 1 Key E type 2230)
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
USB	2x SuperSpeed USB 10Gbps ports on Dual type-A socket
2x SuperSpeed USB 20Gbps ports on USB type-C slots
2x USB 2.0 on pin header
Audio	HD audio codec / Cirrus Logic CS4207
Mic In, Line Out and S/PDIF Out, on pin header
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on pin header
Other Interfaces	2x Expansion M.2 slot (socket 3 Key M type 2280) with 4x PCIe Gen3 lanes
8x GPIOs, 2x I2C, SPI connectors
FAN connector
RST_BTN#, PWR_BTN# and activity LED signals on pin header
Optional TPM 2.0 on-board
Power Supply	+12VDC .. +24VDC range
Cabled coin cell battery for RTC
Operating System	Microsoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)
Operating Temperature	0°C ÷ +60°C (Commercial version)
-40°C÷ +85°C (Industrial version)
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146 x 102 mm (3.5” form factor)

Technical Info
Description	Full connectivity on powerful AMD Ryzen™ platform
CPU	AMD Ryzen™ Embedded V1000 family SoCs:
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25
AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1000 family SoCs:
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W
Max Cores	4
Memory	2x DDR4 ECC and non-ECC SODIMM Slots
Support DDR4-2400 memories (DDR4-3200 with V1807B and V1756B), up to 32GB total
Graphics	GPU AMD Radeon™ VEGA with up to 11 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
4 independent displays supported (3 with R1000 SoCs)
Video Interfaces	4x DP++ connectors (only 3 working with R1000 SoCs)
Video Resolution	DP++: Up to 4096 x 2160
Mass Storage	M.2 NVMe slot (Socket 2 Key M Type 2280), PCI-e x4 interface
microSD Card slot (combo with miniSIM slot)
2x SATA 7p M connectors w/ 1x power connector
Networking	Up to 2 x Gigabit Ethernet ports
M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems
M.2 Connectivity Slot (Socket 1 Key E Type 2230)
USB	2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 3.0 (V1000 SoCs) / USB 2.0 (R1000 SoCs) Host port on WWAN M.2 slot
1 x USB 2.0 Host port on M.2 Connectivity Slot
PCI	1 x PCI-e x4 port on M.2 NVMe Slot
1 x PCI-e x1 port on M.2 WWAN Slot
1 x PCI-e x1 port on M.2 Connectivity Slot
2x PCI-e x1 on Gigabit Ethernet Controllers
Audio	HD Audio codec
Line Out + Microphone + S/PDIF Out interfaces on internal pin header
Serial Ports	2 x RS-232/RS-422/RS-485 UARTS, on internal Pin Header
Other Interfaces	miniSIM slot for M.2 modems (combo with microSD slot)
8 x GPI/Os connector
FAN connector
Switch / LED Front Header connector
2x I2C on internal pin header
Antitamper connector
Optional TPM 1.2 or 2.0 onboard
Power Supply	+12VDC÷ +24VDC
RTC battery
Operating System	Microsoft® Windows 10 (64-bit)
Linux
Operating Temperature	0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version, only for future SoCs in extended temperature range and with TDP ≤25W))
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm

Technical Info
Description	3.5" SBC with the NXP i.MX 8M Mini Processors
CPU	NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite – 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite – 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU
Max Cores	4+1
Memory	Soldered-down LPDDR4 memory, up to 4GB total, 32-bit interface
Graphics	GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support
Video Interfaces	LVDS Single/Dual Channel connector or eDP connector (factory alternatives)
MIPI-CSI Camera interface connector
Video Resolution	Up to 1920x1080p60, 24bpp
Mass Storage	Optional eMMC 5.1 drive on-board, up to 64GB
MicroSD slot
2Kb I2C Flash
QSPI Flash
Networking	2x GbEthernet interfaces (1 optional)
Optional shielded ultra-small dual Band WiFi 802.11 a/b/g/n/ac with Bluetooth 5.0 module onboard
Optional soldered on-board LTE Cat 4 Modem with SIM slot or Telenor eSIM with 5MB Bundle
USB	2x USB 2.0 Host ports on Type-A socket
2x USB 2.0 Host ports on internal pin header
1x USB Host or client port on micro-AB connector (interface shared with the optional on-board modem)
Audio	Digital Mic In connector (2x PDM inputs)
Amplified mono Speaker Output
Serial Ports	Up to 2x RS-232 or RS-485 or CAN Serial ports (factory options, shared with GPIOs and SPI interfaces)
2x Debug UARTS
Other Interfaces	I/O Connectors with: 2xPWM @3.3V GP I2C interface @3.3V 1x Open Drain output (max 12V, 250mA) 2x GPIOs @3.3V 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN (factory options) 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN + on-board ultra-low power RTC (factory options)
Watchdog
Dedicated connector for I2C Touch Screen Controller Support
Onboard Buzzer (Comm. temp. range only)
Optional Ultra Low Power RTC
Power Supply	+12VDC÷ +24VDC
Operating System	Yocto
Android (planned)
Operating Temperature	0°C ÷ +60°C (extended version)
-40°C ÷ +85°C (industrial version, limited to -30°C ÷ +85°C with WiFi/BT module on-board)
*Measured at any point of SECO standard heatsink for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm (3.5" form factor)

Technical Info
Description	3.5” SBC with Rockchip RK3568 SoC
CPU	Rockchip RK3568 processor 4x Cortex®-A55 cores, up to 2.0GHz, 64-bit architecture, with Neural Processing Unit (NPU)
Memory	Soldered-down DDR4-3200 memory, up to 4GB
Graphics	Mali-G52 1-Core-2EE GPU OpenGL ES 1.1/2.0/3.2 Vulkan 1.0 and 1.1 OpenCL 2.0 Full Profile
Embedded Video CODEC H.265/H.264/VP9 4K@60fps HW decoding VP8/VC1/MPEG-4/MPEG-2/MPEG-1 1080p @60fps HW decoding H.265/H.264 1080p@60fps HW encoding Supports 3 independent video outputs
Video Interfaces	HDMI
LVDS single / dual channel interface
eDP 1.3 interface
Video Resolution	HDMI: up to 4K x 2K @60Hz
LVDS: up to 1920 x 1080 @60Hz
eDP: up to 4096 x 2160 (4K)
Mass Storage	eMMC 5.1 drive soldered on-board, up to 64GB (first boot device)
microSD slot (second boot device)
I2C flash
QSPI flash (factory option)
Networking	2x Gigabit Ethernet ports, implemented using TI DP83867 Ethernet PHY on RGMII interface coming from SoC
Optional on-boad M.2 1216 module WLAN 802.11 a/b/g/n/ac + BT 5.0
M.2 Socket 2 Key B for LTE module + microSIM card slot on-board
USB	2x USB 3.0 Type-A
1x USB 2.0 Type-A
1x USB 2.0 OTG micro-AB muxed with one USB 3.0 (used for Deep Recovery)
1x USB 2.0 internal pin header
1x USB 2.0 internal pin header, dedicated to touch screen
Audio	TRRS combo audio jack (stereo mic in, stereo line out)
Mono speaker out (amplified 1.3Watt @8Ohm) on internal header
1x PDM signal ports on internal header
Serial Ports	1x debug UART
1x JTAG port
2x 4 wire RS-232 / RS-422 / RS-485 (multistandard transceivers) on internal header
2x 2 wire TTL UART ports on internal header
Other Interfaces	2x 2-lanes MIPI-CSI camera connector or 1x 4-lanes
M.2 Socket 2 Key M for AI accelerator modules
Dedicated connector for I2C touch screen controller
8x GPIOs or 4x GPIOs + 4 ADC (factory configuration alternatives)
2x CAN, 1x I2C, 1x SPI
Power Supply	+12VDC .. +24VDC range
RTC battery
Operating System	Linux Yocto
Android
Operating Temperature	0°C to +60°C (Commercial version)*
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146 x 102 mm (3.5” form factor)

Analog Inputs
Number of inputs	32 single-ended, 16 differential, or 16 SE + 8 DI; user selectable
A/D resolution	16 bits (1/65,536 of full scale)
Bipolar ranges	±10V, ±5V, ±2.5V, ±1.25V, ±0.625V
Unipolar ranges	0-10V, 0-5V, 0-2.5V, 0-1.25V, 0-.625V,
Input bias current	100pA max
Overvoltage protection	±35V on any analog input without damage
Input Impedance	10^13 ohms
Nonlinearity	±3LSB, no missing codes
Conversion rate	250,000 samples/sec.max
On-board FIFO	1024 16-bit samples
Calibration	Automatic;values stored in EEPROM
Number of outputs	4
D/A resolution	16-bits (1/65536 of full scale) standard, 12-bits (1/4096 of full scale) optional
Output ranges	±5, ±10, 0-5, 0-10, ±2, 5V, programmable in I/O, 53mV steps
Output current	±5mA max per channel
Settling time	6µS max to 0.01%
Relative accuracy	±1 LSB
Nonlinearity	±1 LSB, monotonic
Reset	Reset to zero-scale or mid-scale (jumper selectable)
Calibration	Automatic; values stored in EEPROM
Waveform Buffer	1,024 samples, cyclical
Main I/O	24 programmable I/O
Input current	±1µA max
Output current
Logic 0	64mA max per line
Logic 1	-15mA max per line
Auxilary I/O	4 inputs, 4 outputs, optional use as trigger/control lines
A/D Pacer clock	32-bit down counter (2 82C54 counters cascaded)
Clock source	10MHz on-board clock or external signal
General purpose	16-bit down counter (1 82C54 counter)
Power supply	+5VD±10%@410mA typ
Operating temperature	-40°C to +85°C
Weight	3.4oz/96g
MTBF	972,275 hours at +20°C
RoHS	Compliant

The DMM-16R-AT features top performance and flexibility for a mid-range price. It has 16 single-ended / 8 differential analog voltage inputs with both unipolar and bipolar input ranges, programmable gain, and a maximum sampling rate of 100KHz. The 4 D/A channels and 16 digital I/O lines provide additional real-world control and monitoring capability.

Specifications

Analog Inputs
Number of inputs	8 differential or 16 single-ended (user selectable)
A/D resolution	16 bits (1/65,536 of full scale)
Bipolar ranges	±10V, ±5V, ±2.5V, ±1.25V, ±0.625V
Unipolar ranges	0-10V, 0-5V, 0-2.5V, 0-1.25V
Input bias current	current 3nA max
Overvoltage protection	±35V on any analog input without damage
Input Impedance	10^13 ohms
Nonlinearity	±3LSB, no missing codes
Conversion rate	100,000 samples/sec. max with interrupts
Conversion trigger	Software trigger, internal pacer clock, or external TTL signal
Input FIFO	512 samples,256-sample interupt threshold
A/D interrupt	End of A/D conversion
	End of A/D scan
	FIFO half-full
Calibration	A/D and D/A circuits calibrated under software control using on-board precision references and EEPROM storage
Analog Outputs
Number of outputs	4
D/A resolution	12 bits (1/4096 of full scale)
Output ranges	Fixed: ±5, 0-5V
	Programmable: Anywhere between 0V and 10V in 1mV increments
	Reset: All channels reset to mid-scale (0V for bipolar ranges)
Output current	±5mA max per channel
Settling time	6µS max to 0.01%
Relative accuracy	±1 LSB
Nonlinearity	±1 LSB, monotonic
Digital I/O
Number of lines	16, organized as 2 8-bit ports
Logic Levels	3.3V / 5V jumper selectable
Termination	10K ohm pull-up / pull-down resistors, jumper selectable
Input voltage	Vlogic = 5V
Logic 0	1.65V max
Logic 1	3.35V min
Output voltage	Vlogic = 5V
Logic 0	0.44V max, Iout = 24mA
Logic 1	3.76V min, Iout = -24mA
Input voltage	Vlogic = 3.3V
Logic 0	0.80V max
Logic 1	2.00V min
Output voltage	Vlogic = 3.3V
Logic 0	0.44V max, Iout = 24mA
Logic 1	2.25V min, Iout = -24mA
Counter/Timers
A/D Timer clock	32-bit down counter
General purpose	16-bit down counter
Clock source	10MHz on-board clock or external signal
General
Bus Interface	ISA (5V) bus
Power supply	+5V ±5% @ 390mA typical
Operating temperature	-40°C to +85°C tested and guaranteed
Weight	64g / 2.25oz
RoHS	Compliant

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DIAMOND-MM-16RP-AT

Specifications

Analog Inputs
Number of outputs	8 differential or 16 single-ended (user selectable)
A/D resolution	16 bits (1/65,536 of full scale)
Bipolar ranges	±10V, ±5V, ±2.5V, ±1.25V, ±0.625V
Unipolar ranges	0-10V, 0-5V, 0-2.5V, 0-1.25V
Input bias current	3nA max
Overvoltage protection	±35V on any analog input without damage
Input Impedance	10^13 ohms
Nonlinearity	±3LSB, no missing codes
Conversion rate	100,000 samples/sec. max with interrupts
Conversion trigger	Software trigger, internal pacer clock, or external TTL signal
Input FIFO	512 samples, 256-sample interrupt threshold
A/D interrupt	End of A/D conversion
	End of A/D scan
	FIFO half-full
Calibration	A/D and D/A circuits calibrated under software control using on-board precision references and EEPROM storage
Analog Outputs
Number of outputs	4
D/A resolution	12 bits (1/4096 of full scale)
Output ranges	Fixed: ±5, 0-5V
	Programmable: Anywhere between 0V and 10V in 1mV increments
	Reset: All channels reset to mid-scale (0V for bipolar ranges)
Output current	±5mA max per channel
Settling time	6µS max to 0.01%
Relative accuracy	±1 LSB
Nonlinearity ±1 LSB, monotonic
Digital I/O
Number of lines	16, organized as 2 8-bit ports
Logic Levels	3.3V / 5V jumper selectable
Termination	10K ohm pull-up / pull-down resistors, jumper selectable
Input voltage	Vlogic = 5V
Logic 0	1.65V max
Logic 1	3.35V min
Output voltage	Vlogic = 5V
Logic 0	0.44V max, Iout = 24mA
Logic 1	3.76V min, Iout = -24mA
Input voltage	Vlogic = 3.3V
Logic 0	0.80V max
Logic 1	2.00V min
Output voltage	Vlogic = 3.3V
Logic 0	0.44V max, Iout = 24mA
Logic 1	2.25V min, Iout = -24mA
Counter/Timers
A/D Timer clock	32-bit down counter
General purpose	16-bit down counter
Clock source	10MHz on-board clock or external signal
General
Bus Interface	Dual PCI (3.3V) and ISA (5V) buses supported; Autoselects for PCI bus; manual override option
Power supply	+5V ±5% @ 375mA typical
±15V output	current ±10mA max with DACs unloaded
Operating temperature	-40°C to +85°C tested and guaranteed
Weight	80g / 2.84oz
RoHS	Compliant

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Diamond-MM-AT

The new Diamond-MM-AT analog I/O module offers autocalibration, programmable gain, A/D FIFO, and extended temperature operation to mid-range 12-bit analog I/O users. All these features are added on top of our existing Diamond-MM architecture at the same price as the original board, to bring you an unbeatable combination of features at this price level.

Specifications

Input Impedance

Analog Inputs
Number of outputs	8 differential or 16 single-ended (user selectable)
A/D resolution	12 bits (1/4096 of full scale)
Bipolar ranges	±10V, ±5V, ±2.5V, ±1.25V, ±0.625V
Unipolar ranges	0-10V, 0-5V, 0-2.5V, 0-1.25V
Input bias current	3nA max
Max. input voltage	±10V for linear operation
Overvoltage protection	±35V on any analog input
10^13 ohms
Conversion rate	100,000 samples per second with interrupts
Input FIFO	512 samples, interrupt on half-full
Analog Outputs
Number of outputs	2
D/A resolution	12 bits (1/4096 of full scale)
Output ranges	Fixed: ±5V, 0-5V
Output ranges	Programmable: anywhere between 0V and 10V in 1mV increments
Output current	±5mA max per channel
Settling time	4µS max to ±2/2 LSB
Relative accuracy	±1 LSB
Nonlinearity	±1 LSB, monotonic
Reset	All channels reset to OV
Digital I/O
Number of inputs	8, HCT/TTL compatible
Input voltage
Logic 0:	0.0V min, 0.8V max
Logic 1:	2.0V min, 5.0V max
Input current	±1µA max
Number of outputs	8, HCT/TTL compatible
Output voltage
Logic 0:	0.0V min, 0.33V max
Logic 1:	3.8V min, 5.0 max
Output current
Logic 0:	64mA max per line
Logic 1:	-15mA max per line
Counter/Timers
A/D Pacer clock	32-bit down counter (2 82C54 counters cascaded)
Clock source	10MHz on-board source or external signal
General purpose	16-bit down counter (1 82C54 counter)
Interrupt trigger	End of A/D conversion or scan
General
Calibration	A/D and D/A circuits calibrated under software control
Power supply	+5VD±10%@350mA typical
±15V output current	±10mA max with DACs unloaded
Operating temperature	-40°C to +85°C Extended
Weight	3.3oz/93
RoHS	Compliant

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Diamond-MM

Diamond-MM has all the primary features you expect in a high-performance analog I/O board at a reduced price. The analog input circuit uses a 12-bit A/D converte and can be configured for single-ended or differential input wiring, as well as unipolar or bipolar input ranges. It also offers 10 different input ranges, so it can work with a wide variety of input signals. The maximum A/D conversion rate is approximately 2,000-20,000 per second using interrupts (depending on the operating system) or 100,000 per second using DMA.

Specifications

Analog Inputs
Number of inputs	8 differential or 16 single-ended (user selectable)
A/D resolution	12 bits (1/4096 of full scale)
Bipolar ranges	±10V, ±5V, ±2.5V, ±1V, ±0.5V, Custom
Unipolar ranges	0-10V, 0-5V, 0-2.5V, 0-1V, 0-.5V, Custom
Input bias current	50nA max
Max. input voltage	±10V for linear operation
Overvoltage protection	±35V on any analog input
Input Impedance	10^13 ohms
Conversion trigger	software trigger, internal pacer clock, or external TTL signal
Analog Outputs
Number of outputs	2
D/A resolution	12 bits (1/4096 of full scale)
Output ranges	0-5V, adjustable, or external reference input
Output current	±8mA max per channel
Settling time	4µS max to ±2/2 LSB
Relative accuracy	±1 LSB
Nonlinearity	±1 LSB, monotonic
Reset	All channels reset to OV
Digital I/O
Number of inputs	8, HCT/TTL compatible
Input voltage
Logic 0:	0.0V min, 0.85 max
Logic 1:	2.0V min, 5.0V max
Input current	±1µA max
Number of outputs	8, HCT/TTL compatible
Output voltage
Logic 0:	0.0V min, 0.33 max
Logic 1:	3.8V min, 5.0 max
Output current	±4mA max per line
Counter/Timers
A/D Pacer clock	32-bit down counter (2 82C54 counters cascaded)
Clock source	10MHz on-board source or external signal
General purpose	16-bit down counter (1 82C54 counter)
Interrupt/DMA trigger	End of A/D conversion
General
Power supply	+5VD±10%@165mA typical
±15V output current	±10mA max with DACs unloaded
Operating temperature	0°C to +70°C Standard, -40°C to +85°C Extended
Weight	3.3oz/93g
MTBF	DMM-XT 372,809 hours
RoHS	Compliant

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Ruby-MM-1616A

The Ruby-MM-1616 PC/104 module provides up to 16 channels of 16-bit resolution analog voltage or current output. The output range can be individually selected for 0-5V, 0-10V, ±5V, ±10V, 0-20mA, 4-20mA, or 0-24mA. All outputs are updated simultaneously, either with a software command or in response to an external signal. A waveform generator is available on up to 16 channels with simultaneous updating of all channels.

Specifications

Analog Outputs
Number of outputs	4, 8, or 16
Resolution	16-bits
Output ranges	0-5V, 0-10V unipolar, ±5V, ±10V bipolar
Output ranges	0-20mA, 4-20mA, 0-24mA
Settline time	10us maximum to ±.003%
Linearity error	±2 LSB maximum
Differential nonlinearity	±2 LSB maximum
Monotonicity	15 bits minimum
Maximum output current	±5mA/2KO minimum load
Reset	All DACs reset to 0V
Calibration	Digital with internal scale and offset registers for each channel
Waveform generator	Up to 16 channels
Digital I/O
Number of lines	40 byte-wide, 8 bit-wide, programmable direction
Number of lines	CMOS/TTL compatible (82C55)
Input voltage	Logic 0: -0.5V min, 0.8V max
Input voltage	Logic 1: 2.0V min, 5.5V max
Output voltage	±Logic 0: 0.0V min, 0.4V max
Output voltage	Logic 1: 3.0V min, 4.6V max
Output current	±2.5mA maximum per line
Pull-up resistor	10KO on each I/O lines
External trigger	TTL/CMOS compatible, 10KO pull-up resistor, active high edge
Reset	All digital I/O lines are set to input and all data registers are set to 0
Counter/timers	2 32-bit programmable; 40MHz clock
Pulse width modulators	4 24-bit
General
Input Power	+5VDC ±10%
Operating temperature	-40°C to +85°C Extended
Dimensions	90mm x 96mm (3.55" x 3.775")
Form Factor	PC/104 compliant
Weight	3.0oz (85g)
MTBF	100,000 hours
RoHS	Compliant

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Digital I/O Module

GPIO-MM

GPIO-MM is a PC/104 digital I/O module based on an FPGA, allowing multiple feature sets to be implemented on the same hardware platform. The FPGA is a Xilinx Spartan 2 RAM-based device with 200K gates (XC2S200). An on-board configuraton flash memory device stores the FPGA code for automatic loading on power-up, and new code can be downloaded using a JTAG cable connected to a PC. Several standard off the shelf personalities are available, and custom ones can be developed either by users with Xilinx tools or by Diamond as a customization service.

Specifications

Base FPGA	Xilinx Spartan II, 200,000 gates, 40K RAM bits
Input clock	40MHz
FPGA code storage	Flash memory, field upgradeable via JTAG
ID indicator	8-bit LED display indicates FPGA code personality
No. of I/O pins	100 pins (48 buffered)
Programmable Digital I/O	48 using 8255 cores
Fixed Direction I/O	8 fixed inputs and 8 fixed outputs
Counter/timers	10 16-bit, using 9513 cores
Max counting freq	40MHz
Counter modes	Counter, rate/square-wave generator, programmable one-shot, hardware/software triggered strobe
Output current, buffered I/O	Logic 0: 64mA max per line
Ouptut current,fixed I/O and fixed counter/timers	±24mA max
Dimensions	3.55" x 3.775", PC/104 form factor
PC/104 bus	16-bit stackthrough ISA bus
Power supply	+5VDC ±5%
Operating temperature	-40°C to +85°C standard, all versions
RoHS	Compliant

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GPIO-MM-12

GPIO-MM-12 is part of a family of reconfigurable digital I/O and counter / timer modules with various port and pin configurations. Each board uses identical hardware with a 200K gate Xilinx Spartan II RAM-based FPGA. The varying configurations are based on different FPGA code. The FPGA code is stored in a flash memory on the board, enabling GPIO-MM-12 to be reprogrammed in the field with different designs, including custom designs.

Specifications

Base FPGA	Xilinx Spartan II, 200,000 gates, 40K RAM bits
Input clock	40MHz
FPGA code storage	Flash memory, field upgradeable via JTAG
No. of I/O pins	100 pins (48 buffered)
Programmable Digital I/O	48 using 8255 cores
Fixed Direction I/O	8 fixed inputs and 8 fixed outputs
Counter/timers	10 16-bit, using 9513 cores
Max counting freq	40MHz
Counter modes	Counter, rate/square-wave generator, pulse-width modulator, programmable one-shot, hardware/software triggered strobe
Output current, buffered I/O	Logic 0: 64mA max per line
Ouptut current, fixed I/O and fixed counter/timers	±24mA max
Dimensions	3.55" x 3.775", PC/104 form factor
PC/104 bus	16-bit stackthrough ISA bus
Power supply	+5VDC ±5%
Operating temperature	-40°C to +85°C standard, all versions
RoHS	Compliant

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GPIO-MM-21

GPIO-MM-21 is part of a family of reconfigurable digital I/O and counter / timer modules with various port and pin configurations. Each board uses identical hardware with a 200K gate Xilinx Spartan II RAM-based FPGA. The varying configurations are based on different FPGA code. The FPGA code is stored in a flash memory on the board, enabling GPIO-MM-21 to be reprogrammed in the field with different designs, including custom designs.

Specifications

Base FPGA	Xilinx Spartan II, 200,000 gates, 40K RAM bits
Input clock	40MHz
FPGA code storage	Flash memory, field upgradeable via JTAG
ID indicator	8-bit LED display indicates FPGA code personality
No. of I/O pins	100 pins (48 buffered)
Programmable Digital I/O	96 using 8255 cores
Output current, buffered I/O	Logic 0: 64mA max per line
Dimensions	3.55" x 3.775", PC/104 form factor
PC/104 bus	16-bit stackthrough ISA bus
Power supply	+5VDC ±5%
Operating temperature	-40°C to +85°C standard, all versions
RoHS	Compliant

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Onyx-MM

Extensive software control of features is the highlight of this digital I/O module featuring 48 digital I/O lines, 3 16-bit counter/timers, and 3 independent PC bus interrupt inputs.

The 48 digital I/O lines on Onyx-MM are based on 2 82C55 ICs. They can be programmed for input or output in groups of 8 lines. Direct as well as strobed (latched) I/O modes are supported, and all I/O lines are connected to 10K Ohm pull-up resistors.

Specifications

Counter/Timers
Chip	82C54-2
Counter/timers	3, 16 bits wide
Maximum input freq.	10MHz
On-board osc.	4MHz ±.01%
Signal type	TTL
Input voltage
Low:	-0.5V min, 0.8V max
High:	2.0V min, 5.5V max
Input current	-200µA max (low), 2µA max (high)
Output voltage
Low:	0.0V min, 0.4V max
High:	3.0V min, Vcc -0.4V max
Output current	±2.5mA max, each line
Pullup resistors	10KO all input lines
Digital I/O
Digital I/O	Chip	82C55A (qty. 2)
Number of I/O lines	48, TTL/CMOS Compatible
Direction	All lines programmable for input in groups of 4 and 8
Output current	±2.5mA max, each line
Pullup resistors	10KO all input lines
Interrupts
Interrupts	Number of interrupts	3
Pull-down resistor	1KO resistor selectable via jumper on each interrupt
Interrupt level	2 - 7
Interrupt sources	Counter/timer outputs, Interrupt input, or DIO lines CO (programmable)
General
General	Power supply	+5V ±10% @ 120mA typical all outputs open
Temperature	-40° to +85°C extended
PC/104 Bus	8 bits
Weight	2.8 oz/79g
RoHS	Compliant

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Onyx-MM-DIO

This module is the same as our Onyx-MM digital & counter/timer module but without the counter/timer and interrupt circuitry. This board still has the quality and attention to detail of our other modules, such as: 10K Ohm pull-up resistors on all I/O lines; all ports reset to 0 on power-up or system reset; connector pinouts compatible with our other digital I/O boards; and free software.

The 48 digital I/O lines on Onyx-MM-DIO are based on 2 82C55 ICs. They can be programmed for input or output in groups of 8 lines. Direct as well as strobed (latched) I/O modes are supported, and all I/O lines are connected to 10K Ohm pull-up resistors.

Specifications

Digital I/O
Chip	82C55A (qty. 2)
Number of I/O lines	48
Direction	Programmable in groups of 4 or 8
Input voltage
Low:	-0.5V min, 0.8V max
High:	2.0V min, 5.5V max
Output voltage
Low:	0.0V min, 0.4V max
High:	3.0V min, Vcc -0.4V max
Output current	±2.5mA max, each line
Pullup resistors	10KO all input lines
General
General	Power supply	+5V ±10% @ 120mA typical all outputs open
Temperature	-40°C to +85°C
PC/104 Bus	8 bits
Weight	2.3 oz/65g
MTBF	OMM-DIO-XT 1,714,901 hours
RoHS	Compliant

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Opal-MM-1616 Opto In + Relay Out Module

pal-MM-1616 is a PC/104 format digital I/O module designed for industrial applications requiring isolation between the computer and the external signals it is monitoring and controlling.

Specifications

Optoisolated Inputs
Number of inputs	16 unidirectional optoisolated inputs
Input capacity	30VDC with current limiting resistors
Input impedance	8k ohms
Logic levels	Logic 0: 0 - 1.5VDC
Logic levels	Logic 1: 3 - 30VDC
Programmability	Programmable edge detection with interrupts
Relay Outputs
Relay Outputs	Number of outputs	16 relay outputs
Relay contacts	SPDT (Form C) contacts
Relay contacts	Break before make
Current capacity	2A
Switching capacity	30VDC at 2A
Switching capacity	125VAC at 0.1A resistive
Maximum switching capacity	30W (DC)
Contact resistance	50mohm max
Actuation time	Operate: 5ms maximum
Actuation time	Release: 5ms maximum
Relay lifetime	10,000,000 operations
Relay Outputs
Relay Outputs	Number of outputs	16 relay outputs
Relay contacts	SPDT (Form C) contacts
Relay contacts	Break before make
Current capacity	2A
Switching capacity	30VDC at 2A
Switching capacity	125VAC at 0.1A resistive
Maximum switching capacity	30W (DC)
Contact resistance	50mohm max
Actuation time	Operate: 5ms maximum
Actuation time	Release: 5ms maximum
Relay lifetime	10,000,000 operations
General
I/O header	Optoisolated inputs: 1 34-pin (2 x 17) header on .1" connector
I/O header	Relay outputs: 2 26-pin (2 x 13) headers on .1" connecters
Mating Cables:	C-34-18 for optoisolated inputs
Mating Cables:	C-26-18 for relay outputs (quantity 2)
Isolation (all I/O)	500VDC or AC, input to board or board to output
Isolation (all I/O)	Channel to channel isolation
Power supply	+5VDC ±10%
Current consumption	70mA typical, all relays off; additional 28mA per activated relay
Bus interface	PC/104 (ISA) bus
Form factor	PC/104 (3.55" x 3.775")
Operating temperature	-40°C to +85°C (-40°F to +185°F)
Weight	3.4oz (96g)
Universal Driver support
RoHS	Compliant

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Pearl-MM Relay Output Module

Pearl-MM is a PC/104 format industrial control module with 16 relays. The relays have PDT (form C) configuration. Each relay has 3 contacts: Common, Normally Open, and Normally Closed. For safety and reliability, all relays are in their power-off state (Common connected to Normally Closed) at power-up or system reset. The relays can switch both AC and DC voltages. They feature long life (100,000,000 operations), quick actuation time (4ms max operate and release), and isolation (500V AC or DC).

Specifications

Relays
No. of Outputs	16
Relay type	SPDT (Form C)
Max voltage/current DC:	0VDC/2A 60W (DC), 60VA (AC)
Max voltage/current DC:	AC: 125VAC/0.5A resistive
Max switching capacity	220VDC, 250VAC
Max operating voltage	10mA@10mVDC
Contact resistance	100mO max
Relay lifetime	100,000,000 operations
Actuation time	4ms max operate or release
General
I/O connections	50-position (2x20) .025” square pin header on .1” centers
Isolation (all I/O)	500VDC or AC, channel-to-channel and channel-to-board
Power supply	+5VDC ±10%
Operating temperature	-40°C to +85°C
Operating humidity	5% to 95% non-condensing
Weight	3.4oz / 96g
MTBF	118,227 hours
RoHS	Compliant

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IR104-PBF Opto In & Relay Out Module

IR104-PBF is a high-density PC/104 format digital I/O module designed for industrial applications requiring isolation between the computer and the external signals it is monitoring and controlling. This module features 20 optoisolated digital inputs and 20 relay outputs. Each input can accept both AC and DC voltages as low as 3V and as high as 24V.

Specifications

I/O connectors
Inputs	20 Optoisolated inputs
Input voltage	3-24V AD or AC
Input impedance	2.8KO
Outputs	20 SPST relays
Max voltage	150VDC, 250 VAC
Max current	5A AC or DC (30VDC max)
Max power	150W, 1250VA
Contact resistance	30mO initially
UL rating	5A/30VDC or 250VAC 1/10HP 120VAC
Lifetime	20,000,000 cycles mechanical 100,000 cycles @ full power
Actuation time	6ms operate, 3ms release
Inputs:	2x20 pin header, .1" spacing
Outputs:	Dual 1x20 detachable screw terminals
Power	5V @ 110mA typ (all relays off)
Operating Temp	-25°C to +70°C
Size	3.550" x 3.775"
Size	0.492" max component height
Weight	3.2 oz/90g
MTBF	57,450 hours
RoHS	Compliant

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P104-GPIO96

P104-GPIO96 is a programmable PCI-104 DIO module using a high-capacity (700K gate equivalent) PCI Express FPGA for maximum density and flexibility. The base hardware configuration features 96 digital I/O lines grouped into 12 8-bit ports. All ports have I/O buffers to protect the FPGA and feature 5V logic drive levels. The ports are organized into a combination of byte-wide, nibble-wide, and bit-wide direction control for maximum flexibility and application compatibility.

Specifications

Base FPGA	LatticeECP3, 700K gate equivalents
Input clock	50MHz
FPGA code storage	Flash memory, field upgradeable via JTAG
Total I/O lines	96
Primary I/O	48 lines with 3 8-bit and 2 4-bit; configurable pull-up/down resistors
Secondary I/O	48 lines with 6 8-bit buffers; configurable pull-up/down resistors
Counter/timers	8 32-bit up/down counters (alternate mode)
Max counting frequency	(coming soon)
Counter modes	Counter, rate/square-wave generator, pulse-width modulator, programmable one-shot, hardware/software triggered strobe
Output current	Ports A, B & D: 24mA per pin max; 200mA per port max
	Port C low: 24mA per pin max
	Port C high: -24mA per pin max
	Ports E & F: 32mA per pin max
Input current	+/-340uA max
Form Factor	PC/104-Plus
Expansion	PC/104-Plus (ISA + PCI) stackable expansion
Dimensions	3.55 x 3.775 in. (90 x 96 mm)
Power supply	3.3VDC ±5%
Operating temperature	-40°C to +85°C standard
Weight	3.4oz (96g)
RoHS	Compliant

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DS-MPE-GPIO

The DS-MPE-GPIO is a rugged, low cost 36-channel digital I/O PCIe MiniCard module that is ideal for digital I/O expansion in embedded and OEM applications.

An FPGA provides 36 buffered digital I/O lines that can be configured to operate in simple I/O mode in the form of 8-bit and 4-bit ports, or in counter/timer and pulse width modulator modes. Two ports are fixed digital I/O ports with programmable direction in 8-bit groups. One port can operate as either a 4-bit DIO or 4 counter/timers with 1 input and 1 output per counter. One port can operate as either 8 DIO or up to 8 pulse width modulators.

Specifications

Number of DIO	36
Pull-up / Pull-down	Software configurable
Transceivers	3245 with high current output
Power-up / Reset	DIO in input mode
Pulse Width Modulators	Up to 4 24-bit circuits configurable
	0-100% duty cycle
	On/off control
	Programmable polarity
Counter / Timers	4 32-bit circuits configurable Programmable
Input power	+3.3VDC +/-5%
Power consumption	100mA @ 3.3V
Software drivers	Windows 7, XP, CE
Software drivers	Linux 2.6.16, 2.6.27, 2.6.31, 2.6.32
Universal Driver	Support for all functions
Form Factor	PCIe MiniCard full size
Dimensions	50.95 x 30mm (2 x 1.18")
Operating temperature	-40ºC to +85ºC
Operating humidity	5% to 95% noncondensing
MTBF	tbd
Weight	8.5g (0.3oz)
RoHS	Compliant

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PCIe MiniCard Carrier

The PCIe MiniCard carrier offers four PCIe MiniCard sockets on a compact PCI/104 Express form factor board. All four sockets have PCIe x 1 and USB interfaces and support full size and half size PCIe MiniCard modules.

The module provides full support to all sockets while consuming only a single lane of host SBC resources. SIM card support is provided for two sockets.

Specifications

Number of PCIe MiniCard sockets	4
Card Size	Full and half size cards supported
SIM support	2 sockets support SIM cards
Interfaces	PCIe x1 and USB
Host interface	PCI-104 pass through
LEDs	LEDs provided for all 4 sockets
Form FactorDimensions	PCI/104-Express form factor with wings: 4.5" x 3.775" (114mm x 96mm)
Power supply	+5VDC ±5%
Operating temperature	-40°C to +85°C (-40°F to +185°F)
Operating humidity	5% to 95% non-condensing
Shock	MIL-STD-202G compatible
Vibration	MIL-STD202G compatible
MTBF	tbd hours at 20°C
Weight	2.5oz (71g)
RoHS	Compliant

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Serial I/O Module

Emerald-MM-8PL-XT

Emerald-MM-8PL offers 8 multi-protocol serial ports on a single PC/104 module with complete software configurability via the operating system. Each port can be individually selected for RS-232, RS-422, or RS-485 under software control. Both local-echo and non-local-echo modes are supported for RS-485. I/O addresses and interrupt levels are also programmable, with interrupt sharing available for any number of ports. Each port may further be enabled or disabled in software. All configuration data is stored in an on-board EEPROM that is loaded automatically on power-up.

Specifications

Serial Ports
Number of serial ports	8
Protocols	RS-232, RS-422, RS-485 (local and no echo)
Configuration	All features software configurable
Maximum baud rate	460.8kbps
Communications parameters	5, 6, 7, or 8 data bits; Even, odd, or no parity
Short circuit protection	Continuous, all outputs
RS-232 mode
Input Impedance	3KO min
Input voltage swing	±30V maximum
Output voltage swing	±5V min, ±7V typical
RS-422/RS-485 modes:
Differential input threshold	-0.2V min, +0.2V max
Input impedance	12KO minimum
Input current	+1.0mA max (Vin = 12V)
Input current	-0.8mA max (Vin = -7V)
Differential output voltage	2.0V min (RL=50O)
High/low states differentia output voltage symmetry	0.2V max
Digital I/O
Number of I/O lines	8 in, 8 out
Input voltage	Low: -0.3V min, 0.8V max
Output voltage	Low: 0.0V min, 0.4V max (IOL = 6mA max)
General
I/O header	2 40-position (2x10) .025" square pin header on .1" centers;
I/O header	Headers mate with standard ribbon cable (IDC) connectors
Dimensions	3.55" x 3.775"
Power supply	+5VDC ±10%
Current consumption	160mA typical, all outputs unloaded
Operating temperature	-40°C to +85°C standard, all versions
MTBF	EMM-8P-XT: 490,502 hours
RoHS	Compliant

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Emerald-MM-4M 4-Port

Our Emerald-MM PC/104 module gives you 4 serial ports operating at speeds up to 115kbps.

In RS-232 mode, the full complement of standard PC serial port signals (8 signals + ground) are provided for each port and are grouped onto two 20-pin headers (2 ports per header). In RS-422 mode, Signals RX+, RX-, TX+, and TX- are provided, along with ground. In RS-485 mode, signals TX+/RX+ and TX-/RX- are provided, along with ground.

Specifications

Serial Ports
Number of serial ports	4
Protocol	RS-232, RS-422, RS-485 (jumper selected)
Maximum baud rate	115kbps standard version
Maximum baud rate	460.8kbps available (EMM-HS-XT)
Communications parameters	5, 6, 7, or 8 data bits
Communications parameters	Even, odd, or no parity
Short circuit protection	All outputs protected against continuous short circuit
RS-232 mode:
Input impedance	3KO minimum
Input voltage swing	±30V maximum
Output voltage swing	±5V min, ±7V typical
RS-422, RS-485 modes:
Differential	-0.2V min, +0.2V max input threshold
Input impedance	12KO minimum
Input current	+1.0µA max (VIN = 12V)
Input current	-0.8µA max (VIN = -7V)
Differential output voltage	2.0V min (RL=50O)
High/low states differential output voltage symmetry	0.2V maximum
General
I/O header	2 20-position (2x10) .025" square pin header on .1" center;
I/O header	Headers mate with standard ribbon cable (IDC) connectors
Dimensions	3.55" x 3.775"
Power supply	+5VDC ±10%
Current consumption	80mA typical, all outputs unloaded
Operating temperature	-40°C to +85°C Extended
Operating humidity	5% to 95% noncondensing
PC/104 bus	8-bit and 16-bit bus headers are installed
Weight	2.6oz/74g
MTBF	EMM-4M-XT 555,428 hours
RoHS	Compliant

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Emerald-MM-Opto 4-Port Opto

Emerald-MM-Opto provides an integrated, rugged, and reliable solution for PC/104-expandable embedded systems requiring serial communications in demanding applications. It offers 2 or 4 optically isolated serial ports with RS-232, RS-422, and RS-485 protocols, as well as 24 digital I/O lines, all on a single board.

Specifications

Serial Ports	2 or 4, RS-232/422/485
Data Rates	RS-232, 230.4kbps max
Data Rates	RS-422/485: 460.8kbps max
Signals	RS-232: RXD, TXD, RTS, CTS
Signals	RS-422/485: RXD, TXD
Addresses	8 preconfigured standard I/O address options; custom addresses available
Interrupts	IRQ levels 2, 3, 4, 5, 6, 7, 10, 12, 15;
Interrupts	Interrupt sharing supported
Isolation	1000V AC or DC, port to port or port to system
Termination	150? with 1K? pull-up/pull-down
UART	16C2850 with 128-byte FIFO and auto-flow control
Digital I/O	24 programmable direction using 82C55
DIO termination	10K? pull-up
Connectors	Individual 10-pin connector for each serial port; 26-pin connector for digital I/O
Bus PC/104	16-bit bus (8-bit data)
Power	+5VDC @ 300mA typical, all outputs open
Operating Temperature	-40ºC to +85ºC
Dimensions	3.550"W x 3.775"H
RoHS	Compliant

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Emerald-MM-8PLUS 8-Port

Emerald-MM-8Plus is a high performance multi-protocol serial communications board offering eight ports on a single PC/104-Plus module. Supporting baud rates up to 921.6K bps in RS-232 mode or 1.8432Mbps in RS422 or RS485 mode, each port can be individually selected for RS-232, RS-422, RS-485 or TTL level operation. Both local-echo and non-local-echo modes are supported for RS-485. Protocol selection is achieved via a jumper block for each of the eight ports. Line termination for RS-422/485 modes is also jumper-selectable.

Specifications

Serial Ports
Number of serial ports	8
Protocols	RS-232, RS-422, RS-485 (local and no echo)
Protocol Configuration	Jumpers
Software Configuration	Plug and Play
Maximum baud rate	1.8432Mbps
Communications parameters	5, 6, 7, or 8 data bits; Even, odd, or no parity
Short circuit protection	Continuous, all outputs
RS-232 mode
Input Impedance	3KO min
Input voltage swing	±30V maximum
Output voltage swing	±5V min, ±7V typical
RS-422/RS-485 modes:
Differential input threshold	-0.2V min, +0.2V max
Input impedance	12KO minimum
Input current	+1.0mA max (Vin = 12V)
Input current	-0.8mA max (Vin = -7V)
Differential output voltage	2.0V min (RL=50O)
High/low states differentia output voltage symmetry	0.2V max
Digital I/O
Number of I/O lines	8 individually programmable
Input voltage	Logic 0: -0.3V min, 0.8V max
Input voltage	Logic 1: 2.0V min, 5.3V max
Output voltage	0: 6mA max
Output voltage	1: -4mA max
General
I/O header	2 40-position (2x20) .025" square pin header on .1" centers;
I/O header	Headers mate with standard ribbon cable (IDC) connectors
Dimensions	3.55" x 3.775"
Power supply	+5VDC ±10%
Current consumption	160mA typical, all outputs unloaded
Operating temperature	-40°C to +85°C standard, all versions
Weight	3.1oz (87.9g)
RoHS	Compliant

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Emerald-MM-8EL 4- or 8-Port

The Emerald-MM-8EL-XT is a family of high performance PCIe/104 "OneBank" serial I/O modules offering 4 or 8 multiprotocol serial ports with software-controlled configuration and optional opto-isolation.

Specifications

Serial Ports
Number of serial ports	4 or 8
Protocols	RS-232, RS-422, RS-485 configured with software, no jumpers
Maximum baud rate	RS-232 mode: 1Mbps
Maximum baud rate	RS-422/485 mode: 10Mbps
UART	16550 compatible octal UART with 256-byte TX/RX FIFOs
Transceivers	SP330 multiprotocol transceivers, one per port
Communications parameters	5, 6, 7, or 8 data bits; Even, odd, or no parity
Termination	Software programmable RS-422/485 termination
Isolation	Independent 2500VRMS isolation port-by-port
ESD protection	+/-15KV on each port
Short circuit protection	Continuous, all outputs
RS-232 mode
Input Impedance	3KO min
Input voltage swing	±30V maximum
Output voltage swing	±5V min, ±7V typical
RS-422/485 modes
Differential input threshold	-0.2V min, +0.2V max
Input impedance	12KO minimum
Input current	+1.0mA max (Vin = 12V)
Input current	-0.8mA max (Vin = -7V)
Differential output voltage	2.0V min (RL=50O)
High/low states differential output voltage symmetry	0.2V max
Digital / Analog I/O
Number of lines	8 individually programmable lines:
	8 as digital input or output
	7 as 12-bit analog input
Analog input ranges	0-2.048V or 0-3.3V
General
Host interface	PCIex1 using PCIe/104 OneBank connector
Inrush current	Staggered turn-on of isolated devices for reduced inrush current at power on
On-board microcontroller	On-board PIC microcontroller with flash to manage and store configurations
Connectors	Latching connectors on all ports for increased ruggedness
Dimensions	3.55" x 3.775" (90mm x 96mm)
Dimensions	Conforms to PCIe/104 OneBank form factor supporting Type 1 and Type 2
Power supply	+5VDC ±5%
Current consumption	160mA typical, all outputs unloaded
Software drivers	Windows Embedded Standard 7, XP, 2000 and Vista
Software drivers	Linux 2.6.16, 2.6.31 and 2.6.32
Operating temperature	-40°C to +85°C (-40°F to +185°F)
Operating humidity	5% to 95% non-condensing
Shock	MIL-STD-202G compatible
Vibration	MIL-STD202G compatible
MTBF	579,352 hours at 20°C
Weight	2.5oz (71g)
RoHS	Compliant

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DS-MPE-SER4M

The DS-MPE-SER4M is a rugged, low cost 4-port high speed PCIe MiniCard module that is ideal for serial I/O expansion in embedded and OEM applications. Extended temperature capability (-40°C to +85°C) enables the board to operate in environments with extreme temperature swings, such as vehicles or outdoor installations. In addition, the board may be custom-configured with 0-ohm resistors in place of jumper blocks for increased ruggedness in high-vibration environments.

Specifications

Number of serial ports	4
Protocols	RS-232/422/485 on each port jumper or software configured
Maximum baud rate	RS-232: 1Mbps
Maximum baud rate	RS-422/485: 10Mbps
UARTs	16550 compatible
FIFO	256-byte TX/RX
ESD protection	+/-15KV
Input power	+3.3VDC +/-5%
Power consumption	0.462W @ 3.3V
Software drivers	Windows XP
Software drivers	Linux 2.6.16, 2.6.27, 2.6.31, 2.6.32
Form Factor	PCIe MiniCard full size
Dimensions	50.95 x 30mm (2 x 1.18")
Operating temperature	-40ºC to +85ºC
Operating humidity	5% to 95% noncondensing
MTBF	tbd
Weight	8.5g (0.3oz)
RoHS	Compliant

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DS-MPE-SER4OPT Opto

The DS-MPE-SER4OPT is a rugged, low cost 4-port opto-isolated PCIe MiniCard serial module that is ideal for serial I/O expansion in embedded and OEM applications.

Extended temperature capability (-40°C to +85°C) enables the board to operate in environments with extreme temperature swings, such as vehicles or outdoor installations. In addition, the board may be custom-configured with 0-ohm resistors in place of jumper blocks for increased ruggedness in high-vibration environments.

Specifications

Number of serial ports	4
Protocols	RS-232/485 on each port, configured in pairs
Maximum baud rate	RS-232: 1Mbps
Maximum baud rate	RS-485: 10Mbps
Termination	RS-485 jumper selectable
UARTs	Quad XR17V354 with PCIe interface
FIFO	256-byte TX/RX
Transceiver	SP336 multi-mode
Isolation	+/-500V input/output
Input power	+3.3VDC +/-5%
Power consumption	0.462W @ 3.3V
Software drivers	Windows 7, XP, Vista, 2000
Software drivers	Linux 2.6.16, 2.6.27, 2.6.31, 2.6.32
Form Factor	PCIe MiniCard full size
Dimensions	50.95 x 30mm (2 x 1.18")
Operating temperature	-40ºC to +85ºC
Operating humidity	5% to 95% noncondensing
MTBF	tbd
Weight	8.5g (0.3oz)
RoHS	Compliant

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NVIDIA Solutions

March 3, 2023

OSBOURNE

Osbourne is a versatile carrier board for the NVIDIA Jetson AGX Orin high-performance GPU module. It provides access to all I/O features of the Orin module and includes numerous sockets for I/O expansion. Osbourne has been designed to be used in almost any application ranging from commercial to industrial to airborne to rugged military use.

Key highlights of Osbourne include:

Industry-standard camera adapter socket for use with a wide range of CSI, GMSL, and other cameras
10Gb Ethernet + 1GB Ethernet ports
Wide temperature operation – matching the range of the Orin module
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory (M key 2242/2280) and network connectivity (E key 2230)
I/O concentrator connector enables use with standard and custom I/O breakout boards

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STEVIE

STEVIE is a compact, low-cost, feature-packed carrier board solution for the NVIDIA Jetson AGX Xavier computer module. STEVIE measures 92 x 106mm (3.62 x 4.17"), just slightly larger than the AGX Xavier module (87 x 100mm). This small outline enables Stevie to provide the maximum amount of I/O and support full-size 2280 M.2 modules in the smallest possible size.

The table below lists the I/O features of the available Stevie configurations. In all respects not listed, all models are identical.

Model	STV-BB01	STV-BB02	STV-BB03
Description	Full featured model	Single Ethernet model with all other features	Cost reduced model
Ethernet	2 Gigabit Ethernet using dual stacked RJ-45 jack	1 Gigabit Ethernet using dual stacked RJ-45 jack; one port inoperative	1 Gigabit Ethernet using single RJ-45 jack
Serial ports	4 RS-232/422/485	4 RS-232/422/485	2 RS-232/422/485
Data Acquisition	Microcontroller with 6 ADC, 2 DAC, 13 GPIO	Microcontroller with 6 ADC, 2 DAC, 13 GPIO	I2C GPIO expander with 16 GPIO lines
USB	2x USB 3.1, 2x USB 2.0	2x USB 3.1, 2x USB 2.0	2x USB 3.1, 2x USB 2.0
HDMI	2	2	2
CAN	2	2	2
Audio	Yes	Yes	Yes
M.2 socket	NVMe x4 2280	NVMe x4 2280	NVMe x4 2280
Mini PCIe socket	1 with PCIe and USB	1 with PCIe and USB	1 with PCIe and USB
Micro SD	1 Micro SD + UFS	1 Micro SD + UFS	1 Micro SD + UFS

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JETBOX-STEVIE

JETBOX-STEVIE is a compact Nvidia Jetson AI computing platform ready to deploy. It includes the high performance Jetson AGX Xavier embedded computing module installed on our STEVIE carrier board with a Linux OS installed and preconfigured to support all the I/O on Stevie. Jetbox-Stevie offers the highest performance Jetson computing platform in the smallest available size.

Jetbox-Stevie features multiple expansion sockets for additional I/O and storage capacity to meet a wide range of application needs. Dual SMA antenna cutouts support the installation of WiFi and cellular modem modules for network connectivity. The enclosure is DIN rail mountable or can be used in a "table top" scenario.

The front panel includes 4 DB9 connectors which provide access to the 4 multi-protocol serial ports on Stevie. Two ports can be converted to CAN by replacing one of the cables with the accessory CAN cable included with the system.

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ELTON

With its NVIDIA Xavier computing power, rugged design, and PCIe/104 expansion capability, Elton offers the ideal platform for implementing high performance computing and AI applications in mobile and harsh environments.

Elton utilizes the NVIDIA Jetson AGX Xavier embedded computer module to deliver unmatched performance for AI, machine learning, image processing, and other compute-intensive tasks. The Xavier module delivers up to 30 TeraOps in performance (3 x 1013 operations per second) at a maximum power dissipation of 30 watts. Xavier also offers scalable performance for applications requiring lower overall power consumption of 10 or 15 watts. The module runs at 32 TOPs on a 512-core Volta GPU with Tensor Cores and accelerators, enabling high-performance AI-powered autonomous machines like never before. At 87 x 100mm (3.4 x 3.9") it is slightly bigger than the other Jetson modules.

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FLOYD SC

The FLOYD SC compact carrier board converts the Nvidia Jetson Nano / TX2 NX / Xavier NX modules into complete embedded systems by providing interface circuitry, I/O connectors for all module features, camera interfaces, power supply, and additional I/O in a solution measuring only 4.3x3.3ï¿½ / 110x85mm. A novel expansion I/O connector enables connection of standard and custom daughterboards with additional I/O functionality to simplify the development of customized Jetson solutions.

Floyd SC features up to 3 CSI camera inputs, 2 Gigabit Ethernet ports, 2 USB 2.0 ports, 1 USB 3.0 port, 1 RS-232 and 1 RS-232/485 serial port, 16 GPIO, and HDMI + DP display support. With the NX module installed a second Ethernet port and a CAN port are available. An M.2 M-Key NVME socket supports both 2242 and 2280 size I/O and flash storage modules. Wide voltage input 7-24V provides adaptability to a range of power supplies.

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JETBOX FLOYD-SC

Jetbox-FloydSC provides a complete deployable solution for AI at the edge utilizing the Nvidia XN / TX2 NX / Nano compact GPU modules. JetBox-Floyd SC includes the Floyd SC carrier board and the selected Jetson module with Linux OS loaded, integrated into a compact steel + aluminum enclosure ready for use.

The integrated heat sink cover provides cooling – no fan is required. An internal M.2 socket supports up to 2TB additional storage beyond the flash included on the Jetson module. Shelf and DIN rail mounting are supported. A 12V AC adapter is included with the system.

With the NX module installed, one CAN port can be made available with an internal cable that replaces one of the serial ports on the front panel.

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Floyd

The FLOYD carrier board converts the Nvidia Jetson Nano and Xavier NX modules into complete embedded systems by providing interface circuitry, I/O connectors for all module features, camera interfaces, power supply, and additional I/O. Camera inputs include 2 PoE Gigabit Ethernet ports, 3 MIPI/CSI 2/4-lane connectors, and 1 USB 3.0 port. MiniCard, M.2, and Micro SD sockets support I/O expansion and storage. FLOYD + NVIDIA redefine possibility; the combination of Nvidia’s performance/power efficiency and Diamond’s I/O enables a new generation of high-compute, low-cost solutions.

Carrier Board Configurations

Floyd is available in two configurations: FLD-BB01 offers the complete suite of I/O features, while FLD-BB02 targets lower-cost applications requiring less I/O. The BB02 model also omits the PCIe switch needed for the BB01 additional I/O, thereby enabling a full PCIe x4 link to the M.2 socket for potentially higher flash memory read/write speeds.

Feature	FLD-BB01	FLD-BB02
Gigabit Ethernet	2	1
PoE	Both ports	No
HDMI	2	1
Camera CSI 4-lane	3	3
USB 3.0	1	1
USB 2.0	2	2
M.2 2280 socket	PCIe x1	PCIe x4
Minicard socket	Full size PCIe	No
SD card	Yes	Yes
GPIO 3.3V	8	8
Serial	2x RS-232/422/485	1x RS-232 1x RS-232/485
SCAN 2.0	1 (NX only)	No

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JETBOX-FLOYD

JETBOX-FLOYD is a compact Nvidia Jetson AI computing platform ready to deploy. It includes the Jetson Nano or NX module installed on our FLOYD carrier board with a Linux OS installed and preconfigured to support all the I/O on Floyd.

Jetbox-Floyd is available in four standard baseline configurations of Jetson module and baseboard features:

Feature	JB-FLD-NAO-01	JB-FLD-NAO-02	JB-FLD-XNX-01	JB-FLD-XNX-02
Jetson module	Nano	Nano	Xavier NX	Xavier NX
Gigabit Ethernet	2	1	2	1
PoE	Both ports	No	Both ports	No
HDMI	2	1	2	1
Camera CSI 4-lane	3	3	3	3
USB 3.0	1	1	1	1
USB 2.0	2	2	2	2
M.2 2280 socket	PCIe x1	PCIe x4	PCIe x1	PCIe x4
Minicard socket	Full size PCIe + USB	No	Full size PCIe + USB	No
SD card	Yes	Yes	Yes	Yes
GPIO 3.3V	8	8	8	8
Serial	2x RS-232/422/485	1x RS-232 1x RS-232/485	2x RS-232/422/485	1x RS-232 1x RS-232/485
CAN 2.0	No	No	1	1

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Ziggy

Ziggy offers a compact, low cost platform for evaluation of Jetson computer modules as well as implementation of a marketable solution for AI and machine learning applications. Ziggy provides access to the most popular I/O features of the Jetson modules, including camera, Ethernet, USB, and serial. In addition it features a unique data acquisition circuit with analog input, analog output, and digital I/O to enable Ziggy to interface to the "real world" of analog and digital sensors and controls.

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Systems

February 16, 2023

GEODE Rugged Mission Computers

GEODE is our newest generation rugged system platform featuring design efficiencies to support rapid delivery of custom systems. A PCB assembly containing the I/O connectors is direct-mounted on the main processor board. In this way the system is more compact, more rugged, and easier to produce, and complex and expensive 38999 cable assemblies are eliminated. The connector board contains extra 38999 connectors to support additional I/O boards installed inside the enclosure via low-cost cabling, so customizing the I/O requires no changes to the case in most cases. This technique significantly reduces the time and cost for realizing custom rugged systems.

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OCTAVIO-SATURN Rugged Industrial Computer

OCTAVIO systems are compact, I/O-rich embedded computers for industrial applications. The form factor maximizes the space available for I/O connectors in a wall mounted or DIN-rail mounted form-factor. Additional I/O boards can be installed in the enclosure and accessed via the ready-made cut-out on the front panel. OCTAVIO-SATURN is based on Diamond’s Saturn SBC, featuring “Apollo Lake” E3950 Atom series quad-core processor running at 1.6GHz, with 4GB soldered RAM. With latching I/O connectors and -40/+85C operation, Saturn provides a rugged platform for embedded computing solutions in harsh environments. Featuring a PCIe / USB MiniCard socket and a PCIe/104 OneBank socket, Octavio-Saturn can be used to install additional I/O boards in the enclosure and bring the I/O out to predefined cut-outs on the front panel.

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SABRE Rugged Systems

The SABRE family from Diamond Systems offers an attractive combination of features, ruggedness, and economy. These systems feature full IP67 rating and MIL-STD-810G compatibility and are ideal for vehicle and other harsh environment applications. Standard configurations offer quick turn solutions based on proven designs, while the system architecture supports quick and low-cost customization with the addition of PC/104 and PCIe MiniCard I/O modules.

The Sabre series consists of two product categories:

SabreCom : rugged computer systems featuring Intel Atom and Core processors and packed with I/O.
SabreNet : rugged Ethernet switches, featuring 8-24 10/100/1000 gigabit copper ports and up to 2 10G fiber ports.

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SabreCom

The SABRE family of rugged mission computers offer a compact form factor and are primarily designed for use in the most challenging vehicle environments. Built up with our range of rugged power supplies, MIL-STD-461, 704, and 1275 compliance is available. Systems have been tested to MIL-STD-810G specifications up to 75G shock.

	SabreCom VNS
Processor	Skylake 6th Gen Core i7 i7-6600U 2C 2.6GHz
RAM	4-20GB
Mass storage	32-256GB SSD
Serial ports	4x RS-232/422/485
USB ports	4x USB 2.0, 2x USB 3.0
Ethernet	2x 10/100/1000
Integrated GPIO	16
Integrated data acquisition
Expansion	PCIe/104, PCI-104, and MiniCard sockets
Standard enclosure size	7.8W x 6.9D x 2.6H in. 198W x 175D x 66H mm
Operating system support	Windows 10 IOT LTSC; Linux Ubuntu 16.04 LTS; 64-bit support

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Analog I/O Module

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Digital I/O Module

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Serial I/O Module

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OSBOURNE

STEVIE

JETBOX-STEVIE

ELTON

FLOYD SC

JETBOX FLOYD-SC

Floyd

JETBOX-FLOYD

Ziggy

ESS Conducts workshops for qualified customers for model based control/ motor controls/ RoboticsWe could do a half/one day session. To qualify for the workshop please fill the following form:

Detailed Proposals

ACROME Lab Manual

Lab Courseware

Lab Experiments

ACROME Online Demo

ESS Conducts workshops for qualified customers for model based control/ motor controls/ Robotics

We could do a half/one day session. To qualify for the workshop please fill the following form: