- System Integration ready solutions
- Reduced time-to-market
- Low design investment
PRISMA
SBC 3.5” SBC with the 11th Gen Intel® CoreTM and Intel® Celeron®
- Available in Industrial Temperature Range
- Data sheet
- SECO Technical Resources
- Support & Documentation
CPU
11th Gen Intel® Core™ processors and Intel® Celeron® SoCs
Graphics
Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
Connectivity
2x SuperSpeed USB 10Gbps; 2x SuperSpeed USB 20Gbps; 2x USB 2.0; 4x PCIe Gen3; 2x 2.5GbE
Memory
Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
| Technical Info | |
|---|---|
| Description | 3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake UP3) Processors |
| CPU | Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, 28W TDP (12W cTDP) |
| Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, 28W TDP (12W cTDP) | |
| Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, 28W TDP (12W cTDP) | |
| Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP | |
| Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, with IBECC, 28W TDP (12W cTDP) – Industrial | |
| Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial | |
| Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial | |
| Max Cores | 4 |
| Memory | 2x DDR4-3200 SODIMM slots |
| Up to 64GB with IBECC supported only with Intel® Core™ Industrial SoCs | |
| Graphics | Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
| Support for up to 48 simultaneous 1080p streams ingestion | |
| Support for up to four independent displays at up to 4K60 | |
| HDR resolution or one display at 8K resolution | |
| Video Interfaces | 2x Multimode DisplayPort 1.4, on Dual DP++ connector |
| 2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode) | |
| 1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface | |
| Video Resolution | DP, eDP Up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC |
| HDMI 1.4 Up to 4Kx2K 24-30Hz 24bpp | |
| Mass Storage | M.2 SATA SSD slot (socket 2 Key B type 2242/3042) ** |
| M.2 NVMe slot (socket 3 Key M type 2280) PCIe Gen4 supported | |
| **SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive | |
| Networking | 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 |
| 2.5GbE controllers | |
| M.2 WWAN slot (socket 2 Key B type 2242/3042) coupled to on-board Micro-SIM slot. ** | |
| M.2 WiFi/BT slot (socket 1 Key E type 2230) | |
| **SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive | |
| USB | 2x SuperSpeed USB 10Gbps ports on Dual type-A socket |
| 2x SuperSpeed USB 20Gbps ports on USB type-C slots | |
| 2x USB 2.0 on pin header | |
| Audio | HD audio codec / Cirrus Logic CS4207 |
| Mic In, Line Out and S/PDIF Out, on pin header | |
| Serial Ports | 2x RS-232/RS-422/RS-485 UARTS software configurable, on pin header |
| Other Interfaces | 2x Expansion M.2 slot (socket 3 Key M type 2280) with 4x PCIe Gen3 lanes |
| 8x GPIOs, 2x I2C, SPI connectors | |
| FAN connector | |
| RST_BTN#, PWR_BTN# and activity LED signals on pin header | |
| Optional TPM 2.0 on-board | |
| Power Supply | +12VDC .. +24VDC range |
| Cabled coin cell battery for RTC | |
| Operating System | Microsoft® Windows 10 IoT Enterprise LTSC 2021 |
| Linux (Kernel ≥ 5.4 version) | |
| Operating Temperature | 0°C ÷ +60°C (Commercial version) |
| -40°C÷ +85°C (Industrial version) | |
| *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
|
| Dimensions | 146 x 102 mm (3.5” form factor) |
MERIDA
3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)
CPU
AMD Ryzen™ Embedded V1000 and R1000 processors
Graphics
AMD Radeon™ Vega GPU with up to 11 Compute Units
Connectivity
2x GbE; M.2 WWAN and WLAN slots; 2x USB3.0; 2x USB 2.0; 8x GPI/Os
Memory
Two DDR4 SO-DIMM Slots supporting DDR4 3200/2400 ECC and non-ECC Memory
| Technical Info | |
|---|---|
| Description | Full connectivity on powerful AMD Ryzen™ platform |
| CPU | AMD Ryzen™ Embedded V1000 family SoCs: |
| AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W | |
| AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W | |
| AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25 | |
| AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W | |
| AMD Ryzen™ Embedded R1000 family SoCs: | |
| AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W | |
| AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W | |
| Max Cores | 4 |
| Memory | 2x DDR4 ECC and non-ECC SODIMM Slots |
| Support DDR4-2400 memories (DDR4-3200 with V1807B and V1756B), up to 32GB total | |
| Graphics | GPU AMD Radeon™ VEGA with up to 11 Compute Units |
| DirectX® 12 supported | |
| H.265 (10-bit) decode and 8-bit video encode | |
| VP9 decode | |
| 4 independent displays supported (3 with R1000 SoCs) | |
| Video Interfaces | 4x DP++ connectors (only 3 working with R1000 SoCs) |
| Video Resolution | DP++: Up to 4096 x 2160 |
| Mass Storage | M.2 NVMe slot (Socket 2 Key M Type 2280), PCI-e x4 interface |
| microSD Card slot (combo with miniSIM slot) | |
| 2x SATA 7p M connectors w/ 1x power connector | |
| Networking | Up to 2 x Gigabit Ethernet ports |
| M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems | |
| M.2 Connectivity Slot (Socket 1 Key E Type 2230) | |
| USB | 2 x USB 3.0 Host ports on USB 3.0 Type-A sockets |
| 2 x USB 2.0 Host ports on internal pin header | |
| 1 x USB 3.0 (V1000 SoCs) / USB 2.0 (R1000 SoCs) Host port on WWAN M.2 slot | |
| 1 x USB 2.0 Host port on M.2 Connectivity Slot | |
| PCI | 1 x PCI-e x4 port on M.2 NVMe Slot |
| 1 x PCI-e x1 port on M.2 WWAN Slot | |
| 1 x PCI-e x1 port on M.2 Connectivity Slot | |
| 2x PCI-e x1 on Gigabit Ethernet Controllers | |
| Audio | HD Audio codec |
| Line Out + Microphone + S/PDIF Out interfaces on internal pin header | |
| Serial Ports | 2 x RS-232/RS-422/RS-485 UARTS, on internal Pin Header |
| Other Interfaces | miniSIM slot for M.2 modems (combo with microSD slot) |
| 8 x GPI/Os connector | |
| FAN connector | |
| Switch / LED Front Header connector | |
| 2x I2C on internal pin header | |
| Antitamper connector | |
| Optional TPM 1.2 or 2.0 onboard | |
| Power Supply | +12VDC÷ +24VDC |
| RTC battery | |
| Operating System | Microsoft® Windows 10 (64-bit) |
| Linux | |
| Operating Temperature | 0°C ÷ +60°C (Commercial version) |
| -40°C ÷ +85°C (Industrial version, only for future SoCs in extended temperature range and with TDP ≤25W)) | |
| *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. | |
| Dimensions | 146x102 mm |
ASTRID
3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61)
CPU
NXP i.MX 8M Mini Family
Graphics
GC320 2D accelerator + GCNanoUltra 3D accelerator
Connectivity
Up to 2x GbE; opt Wifi; up to 2x RS-232 or RS-485 or CAN; opt LTE Cat4 Modem with SIM slot or eSIM
Memory
Soldered on-board LPDDR4-3000 memory
| Technical Info | |
|---|---|
| Description | 3.5" SBC with the NXP i.MX 8M Mini Processors |
| CPU | NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor: |
| i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz | |
| i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz | |
| i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz | |
| i.MX 8M Mini Quad Lite – 4x Cortex®-A53 cores up to 1.8GHz, no VPU | |
| i.MX 8M Mini Dual Lite – 2x Cortex®-A53 cores up to 1.8GHz, no VPU | |
| i.MX 8M Mini Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU | |
| Max Cores | 4+1 |
| Memory | Soldered-down LPDDR4 memory, up to 4GB total, 32-bit interface |
| Graphics | GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer: |
| VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding | |
| AVC/H.264, VP8 HW encoding | |
| OpenGL ES 2.0, OpenVG 1.1 support | |
| Video Interfaces | LVDS Single/Dual Channel connector or eDP connector (factory alternatives) |
| MIPI-CSI Camera interface connector | |
| Video Resolution | Up to 1920x1080p60, 24bpp |
| Mass Storage | Optional eMMC 5.1 drive on-board, up to 64GB |
| MicroSD slot | |
| 2Kb I2C Flash | |
| QSPI Flash | |
| Networking | 2x GbEthernet interfaces (1 optional) |
| Optional shielded ultra-small dual Band WiFi 802.11 a/b/g/n/ac with Bluetooth 5.0 module onboard | |
| Optional soldered on-board LTE Cat 4 Modem with SIM slot or Telenor eSIM with 5MB Bundle | |
| USB | 2x USB 2.0 Host ports on Type-A socket |
| 2x USB 2.0 Host ports on internal pin header | |
| 1x USB Host or client port on micro-AB connector (interface shared with the optional on-board modem) | |
| Audio | Digital Mic In connector (2x PDM inputs) |
| Amplified mono Speaker Output | |
| Serial Ports | Up to 2x RS-232 or RS-485 or CAN Serial ports (factory options, shared with GPIOs and SPI interfaces) |
| 2x Debug UARTS | |
| Other Interfaces | I/O Connectors with:
|
| Watchdog | |
| Dedicated connector for I2C Touch Screen Controller Support | |
| Onboard Buzzer (Comm. temp. range only) | |
| Optional Ultra Low Power RTC | |
| Power Supply | +12VDC÷ +24VDC |
| Operating System | Yocto |
| Android (planned) | |
| Operating Temperature | 0°C ÷ +60°C (extended version) |
| -40°C ÷ +85°C (industrial version, limited to -30°C ÷ +85°C with WiFi/BT module on-board) | |
| *Measured at any point of SECO standard heatsink for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. | |
| Dimensions | 146x102 mm (3.5" form factor) |
SAYLOR
3.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)
CPU
Rockchip RK3568 SoC
Graphics
Mali-G52 1-Core-2EE
Connectivity
2x GbE; opt Wi-Fi; 2x RS-232 or RS-485, 2x CAN; M.2 slot for modem and on-board microSIM slot
Memory
Soldered-down DDR4-3200 memory, up to 4GB
| Technical Info | |
|---|---|
| Description | 3.5” SBC with Rockchip RK3568 SoC |
| CPU | Rockchip RK3568 processor
|
| Memory | Soldered-down DDR4-3200 memory, up to 4GB |
| Graphics | Mali-G52 1-Core-2EE GPU
|
Embedded Video CODEC
|
|
| Video Interfaces | HDMI |
| LVDS single / dual channel interface | |
| eDP 1.3 interface | |
| Video Resolution | HDMI: up to 4K x 2K @60Hz |
| LVDS: up to 1920 x 1080 @60Hz | |
| eDP: up to 4096 x 2160 (4K) | |
| Mass Storage | eMMC 5.1 drive soldered on-board, up to 64GB (first boot device) |
| microSD slot (second boot device) | |
| I2C flash | |
| QSPI flash (factory option) | |
| Networking | 2x Gigabit Ethernet ports, implemented using TI DP83867 Ethernet PHY on RGMII interface coming from SoC |
| Optional on-boad M.2 1216 module WLAN 802.11 a/b/g/n/ac + BT 5.0 | |
| M.2 Socket 2 Key B for LTE module + microSIM card slot on-board | |
| USB | 2x USB 3.0 Type-A |
| 1x USB 2.0 Type-A | |
| 1x USB 2.0 OTG micro-AB muxed with one USB 3.0 (used for Deep Recovery) | |
| 1x USB 2.0 internal pin header | |
| 1x USB 2.0 internal pin header, dedicated to touch screen | |
| Audio | TRRS combo audio jack (stereo mic in, stereo line out) |
| Mono speaker out (amplified 1.3Watt @8Ohm) on internal header | |
| 1x PDM signal ports on internal header | |
| Serial Ports | 1x debug UART |
| 1x JTAG port | |
| 2x 4 wire RS-232 / RS-422 / RS-485 (multistandard transceivers) on internal header | |
| 2x 2 wire TTL UART ports on internal header | |
| Other Interfaces | 2x 2-lanes MIPI-CSI camera connector or 1x 4-lanes |
| M.2 Socket 2 Key M for AI accelerator modules | |
| Dedicated connector for I2C touch screen controller | |
| 8x GPIOs or 4x GPIOs + 4 ADC (factory configuration alternatives) | |
| 2x CAN, 1x I2C, 1x SPI | |
| Power Supply | +12VDC .. +24VDC range |
| RTC battery | |
| Operating System | Linux Yocto |
| Android | |
| Operating Temperature | 0°C to +60°C (Commercial version)* |
| * Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. | |
| Dimensions | 146 x 102 mm (3.5” form factor) |
