- ARM or x86
- Scalable and customizable
- Connectivity
- Integration services
PHOENIX
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-DS)
CPU
11th Gen Intel® Core™ processors and Intel® Celeron® SoCs
Graphics
Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
Connectivity
2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
Memory
Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
| Technical Info | |
|---|---|
| Description | Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3) |
| CPU | Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) |
| Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP) | |
| Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP) | |
| Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP | |
| Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial | |
| Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial | |
| Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial | |
| Max Cores | 4 |
| Memory | 2x DDR4-3200 SODIMM slots |
| Up to 64GB with IBECC supported only with Core™ industrial SoCs | |
| Graphics | Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
| Support for up to four independent displays at up to 4K60 | |
| HDR resolution or one display at 8K resolution | |
| Video Interfaces | 2x Multimode DisplayPort 1.4, on dual DP++ connector |
| 2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode) | |
| Video Resolution | DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
| HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp | |
| Mass Storage | On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB |
| Networking | Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* |
| Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* | |
| *Certification upon request | |
| USB | 2x Superspeed USB 10Gbps ports on Dual Type-A sockets |
| 2x Superspeed USB 20Gbps on USB Type-C slots | |
| Audio | Lineout + MicIn combo TRRS Audio Jack |
| Serial Ports | 2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
| Other Interfaces | Optional 2x 12 poles terminal block connectors with the following I/O:
|
| Power ON Button Optional TPM 1.2/2.0 module on-board |
|
| Power Supply | 12VDC to 24VDC range, Mega-Fit 2p RA Connector |
| Coin cell battery for RTC On-Board | |
| Operating System | Microsoft® Windows 10 IoT Enterprise LTSC |
| Linux LTS | |
| Yocto | |
| Operating Temperature | Commercial range: 0°C to +40°C, with 0.7m/s airflow** |
| Extended range: -30°C to +40°C, with 0.7m/s airflow** |
|
| **Up to 60°C with scaled down CPU TDP | |
| Dimensions | 199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives) |
PYXIS
Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)
CPU
Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors
Graphics
Integrated Intel® Gen11 UHD Graphics controller, up to 32 Execution Units
Connectivity
2x GbE, Optional M.2 WWAN and WLAN modules
Memory
Up to 16GB Quad-Channel LPDDR4 soldered down with IBECC
| Technical Info | |
|---|---|
| Description | Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs |
| CPU | Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDP |
| Intel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDP | |
| Intel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDP | |
| Intel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDP | |
| Intel® Atom® x6211E Dual Core @1.3GHz (3GHz Turbo) 6W TDP w/ IBECC and HIS - Industrial | |
| Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP w/ IBECC and HIS - Industrial | |
| Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP w/ IBECC and IHS - Industrial | |
| Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/ IBECC, IHS and TCC – Industrial | |
| Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/ IBECC, IHS and TCC – Industrial | |
| Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC – Industrial | |
| (*) HIS: Integrated Heatspreader; TCC: Time Coordinated Computing | |
| Memory | Soldered down LPDDR4-3200 memory, up to 16GB with IBECC supported only with Atom® Industrial SoCs |
| Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual rank (16GB) | |
| Graphics | Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU |
| 4K HW decoding and encoding of HEVC (H.265), H.264, VP8, VP9, WMV9/VC1 (decoding only) | |
| DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0 | |
| Video Interfaces | 2x Multimode DisplayPort 1.4, on Dual DP++ connector |
| Video Resolution | Up to 4096x2160 @60Hz |
| Mass Storage | Optional eMMC 5.1 drive soldered on-board |
| Optional on-board M.2 SATA SSD ** | |
| ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive. | |
| Networking | 2x Gigabit Ethernet RJ45 connectors |
| Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) +BT 5.0 module, external antennas* | |
| Optional on-board M.2 LTE modem with nanoSIM slot, external antennas* ** | |
| *Certification upon request | |
| ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive. | |
| USB | Dual USB 3.2 Gen1 Type-A connector |
| Audio | Lineout + MicIn combo TRRS audio jack |
| Serial Ports | 2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
| Other Interfaces | Optional 2x 12 poles terminal block connectors with the following I/O:
|
| Power ON button | |
| nanoSIM slot soldered on-board for the modem | |
| Optional TPM 1.2/2.0 module on-board | |
| Optional 4x SMA connectors for external Wi-Fi / WWAN antennas | |
| Power Supply | +12VDC |
| Cabled coin cell battery for RTC | |
| Operating System | Microsoft® Windows 10 Enterprise |
| Microsoft® Windows 10 IoT Core | |
| Linux | |
| Yocto | |
| Dimensions | 180 x 107 x 75 mm (7” x 4.2” x 3’’) |
PICTOR
Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)
CPU
Rockchip RK3399
Graphics
4-Core Mali-T860MP4 GPU
Connectivity
2x GbE; 2x USB3.0; 2x USB2.0; 2x RS-232 or RS-485; Optional on-board WiFi+BT; Optional on-board LTE modem
Memory
Up to 4GB LPDDR4 on-board memory
| Technical Info | |
|---|---|
| Description | Fanless Embedded Computer based on Rockchip RK3399 Applications Processor |
| CPU | Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x Cortex®-A53 MP cores, up to 1.8GHz, 64-bit architecture |
| Memory | 64-bit soldered down LPDDR4 memory, up to 4GB |
| Graphics | 4-Core Mali-T860MP4 GPU |
| OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support | |
Embedded VPU, able to offer:
|
|
| Video Interfaces | HDMI™ connector |
| DP interface on USB Type-C connector (Alternate mode) | |
| Video Resolution | Up to 4K |
| Mass Storage | Optional eMMC 5.1 drive on-board, up to 64GB |
| Networking | 2x Gigabit Ethernet RJ45 connectors |
| Optional on-board WiFi (802.11 ac / a / b / g / n) +BT 5.0 module, external antennas* | |
| Optional on-board LTE modem with miniSIM slot or eSIM, external antennas* | |
| *Certification upon request | |
| USB | 2 x USB 2.0 on Dual Type-A socket |
| 1 x USB 3.0 Type-C connector (alternate mode with DP) | |
| 1 x USB 3.0 Type-A connector | |
| Audio | Lineout + MicIn combo TRRS Audio Jack |
| Serial Ports | 2 x RS-232 or RS-485 ports (factory options) on DB9-M connectors |
| Other Interfaces | Optional 2x 12 poles terminal block connectors with the following I/O:
|
| Power ON Button with integrated LED | |
| miniSIM slot soldered on-board for the Modem | |
| Optional 4x SMA connectors for external WiFi / WWAN antennas | |
| Power Supply | +12VDC ÷ +24VDC, DC Power Jack |
| Operating System | Linux Yocto |
| Android (planned) | |
| Operating Temperature | 0°C ÷ +50°C |
| Dimensions | 181 x 107 x 75 mm |
EASY EDGE
IoT Sensor to Cloud
CPU
ESP32-D0WD-V3 processor
Connectivity
Programmable expansion connector, CAN Port, dedicated RS-232 / TTL UART
Memory
Internal 520KB SRAM + 16KB SRAM in RTC
| Technical Info | |
|---|---|
| Description | Clea is a combination between the Easy Edge microcontroller and the AI Suite solution. Clea merges the hardware with the AI Suite services creating a subscription service for industrial enterprises of any size. Upon subscribing to Clea, SECO retrofits the customer’s machines with Easy Edge Microcontroller. Clea enhances products with Artificial intelligence, minimizing downtime and boosting productivity. Easy Edge is a Low Power, Feature-rich high Performance Microcontroller with Embedded Connectivity. Easy Edge is a mobile connected (LTE-M/NB-IoT or 2G + Wi-Fi, BT) microcontroller. More on Clea: https://www.seco.com/en/services/Clea_IoT_Platform_AI_Inside |
| CPU | ESP32-D0WD-V3 Dual Core Xtensa® 32-bit LX6 Microprocessor |
| Max Cores | 2 |
| Memory | Internal 520KB SRAM + 16KB SRAM in RTC |
| Mass Storage | 16MB SPI Flash |
| 8MB PSRAM | |
| microSD slot | |
| Networking | Embedded WiFi (802.11 b/g/n) + BT 4.2/BT LE module |
Optional Modem with GNSS functionality:
|
|
| Serial Ports | RS-232 / TTL UART (jumper selectable) port on 6-pin dedicated connector |
| Other Interfaces | Accelerometer |
| Optional Trusted Secure Element | |
Expansion 8-pin connector, able to manage:
|
|
| 1x Pushbutton | |
| White LED for Power On Signaling | |
| Green LED fro Modem Activity Signaling | |
| Blue LED for Edgehog network connection signaling | |
| Yellow LED for WiFi/BT activity or other signaling | |
| eSIM or microSIM slot (factory options) | |
| SMA connectors for WiFi/BT, Modem and GNNS (antennas not provided) | |
| Power Supply | 2-pin micro-Fit Connector |
| +9VDC .. +24VDC | |
| Optional 2000mAh rechargeable battery, LIR18650 | |
| Operating Temperature | 0°÷+45°C |
| Dimensions | 110 x 91 x31 mm (LxWxD) |
